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  4. Heat sink for surface mount devices SQ series (LSI Cooler Co., Ltd.)
Heat sink for surface mount devices SQ series-22SQ22H5
Heat sink for surface mount devices SQ series-LSI Cooler Co., Ltd.

Heat sink for surface mount devices SQ series
LSI Cooler Co., Ltd.

About This Product

We strive to improve the performance of heat sinks and heat sinks. Semiconductor elements (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic devices can destroy the elements themselves due to the heat generated if they are not cooled during operation. A heat sink is a radiator for electronic components that quickly transfers and cools this heat to prevent damage to the device. Most of them consist of a base plate that attaches the heating element and fins that radiate heat from the base plate. Cooling methods can be divided into natural cooling, which uses air convection caused by generated heat, and forced cooling, which uses forced air convection with a fan or a cooling medium such as water. In order to achieve highly efficient heat treatment with a heat sink, LSI coolers continue to pursue higher performance using technology supported by thermal theory.

■Heat sink type

Aluminum extrusion type

■Features

・Slit fin type ·heat sink

  • Product

    Heat sink for surface mount devices SQ series

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1 Models of Heat sink for surface mount devices SQ series

Image Part Number Price (excluding tax) Product weight Thermal resistance (℃/W)
Heat sink for surface mount devices SQ series-Part Number-22SQ22H5

22SQ22H5

Available upon quote

3.4g

55

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LSI Cooler Co., Ltd.

  • Japan

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