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  4. Heat sink FP series for pin mount devices (LSI Cooler Co., Ltd.)
Heat sink FP series for pin mount devices-15FP23
Heat sink FP series for pin mount devices-LSI Cooler Co., Ltd.

Heat sink FP series for pin mount devices
LSI Cooler Co., Ltd.

About This Product

We strive to improve the performance of heat sinks and heat sinks. Semiconductor elements (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic devices can destroy the elements themselves due to the heat generated if they are not cooled during operation. A heat sink is a radiator for electronic components that quickly transfers and cools this heat to prevent damage to the device. Most of them consist of a base plate that attaches the heating element and fins that radiate heat from the base plate. Cooling methods can be divided into natural cooling, which uses air convection caused by generated heat, and forced cooling, which uses forced air convection with a fan or a cooling medium such as water. In order to achieve highly efficient heat treatment with a heat sink, LSI coolers continue to pursue higher performance using technology supported by thermal theory.

■Heat sink type

Aluminum extrusion type

■Features

Heat sink with plate terminal

  • Product

    Heat sink FP series for pin mount devices

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1 Models of Heat sink FP series for pin mount devices

Image Part Number Price (excluding tax) Thermal resistance (℃/W) L=150 Thermal resistance (℃/W) L=100 Unit weight
Heat sink FP series for pin mount devices-Part Number-15FP23

15FP23

Available upon quote

5.2

7.2

0.319kg/m

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LSI Cooler Co., Ltd.

  • Japan

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