Product
Manual flip chip placement system Model 850 with excellent ease of use and positioning accuracyHandling Company
Hugle Electronics Co., Ltd.Categories
Product Image | Part Number | Price (excluding tax) | Accuracy | Air | Bond weighting | Bonding stage | Pickup stage | Power supply | Size | Vacuum | Weight |
---|---|---|---|---|---|---|---|---|---|---|---|
Model 850 |
Available upon quote | ±12μm | 0.42Mpa | 30~200g standard | 4 inch vacuum stage (other sizes optional) | 4 2 inch trays | 110V3A50/60Hz | 762 (D) ×990 (W) ×610 (H) mm | 68kPa | 84kg |