Hugle Electronics Co., Ltd.'s Semiconductor Manufacturing Equipment Component & Part Machining

6 products found

Hugle Electronics Co., Ltd.

Wafer transfer machine compatible with both 6 and 8 inch wafers and SEMI standard wafer Automatic wafer transfer machine

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This device is a wafer transfer machine compatible with both 6 and 8 inch wafers and SEMI standard wafers. The automatic carrier identification fun...

Hugle Electronics Co., Ltd.

Tabletop device that automatically picks up chips after dicing and packs them into trays Supports a maximum wafer size of 8 inches Die sorter CT-200

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This is a tabletop device that automatically picks up chips after dicing and packs them into trays. Compatible with a maximum wafer size of 8in, re...

Hugle Electronics Co., Ltd.

Die sorter CT-300 is a tabletop device that automatically picks up chips after dicing and packs them into trays.

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Last viewed: 43 seconds ago

This is a tabletop device that automatically picks up chips after dicing and packs them into trays. Compatible with a maximum wafer size of 12in, r...

Hugle Electronics Co., Ltd.

Grip ring used to maintain the expanded state of the wafer

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Last viewed: 18 hours ago

A grip ring used to hold the wafer in its expanded state. ■Product overview ・Easy to remove - Lighter, thinner and space-saving compared to conve...

Hugle Electronics Co., Ltd.

Peel the diced chips from the dicing tape without damaging the backside Chip/Tape Separator Model 4800

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Our unique method allows chips to be peeled off from the dicing tape without damaging the back side. ■Product overview ・Model 4800 chip/tape sepa...

Hugle Electronics Co., Ltd.

Manual flip chip placement system Model 850 with excellent ease of use and positioning accuracy

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A manual flip chip placement system with excellent ease of use and positioning accuracy. ■Product overview ・Manual X-Y sliding table ・Micrometer...

Check the product list of Hugle Electronics Co., Ltd.

Hugle Electronics Co., Ltd.'s Semiconductor Manufacturing Equipment Component & Part Machining

Wafer transfer machine compatible with both 6 and 8 inch wafers and SEMI standard wafer Automatic wafer transfer machine

Tabletop device that automatically picks up chips after dicing and packs them into trays Supports a maximum wafer size of 8 inches Die sorter CT-200

Die sorter CT-300 is a tabletop device that automatically picks up chips after dicing and packs them into trays.

Grip ring used to maintain the expanded state of the wafer

Peel the diced chips from the dicing tape without damaging the backside Chip/Tape Separator Model 4800

Manual flip chip placement system Model 850 with excellent ease of use and positioning accuracy

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