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11 products found
Hugle Electronics Co., Ltd.
460+ people viewing
This device is a wafer transfer machine compatible with both 6 and 8 inch wafers and SEMI standard wafers. The automatic carrier identification fun...
Hugle Electronics Co., Ltd.
900+ people viewing
Last viewed: 15 hours ago
This is a tabletop device that automatically picks up chips after dicing and packs them into trays. Compatible with a maximum wafer size of 8in, re...
Hugle Electronics Co., Ltd.
1370+ people viewing
Last viewed: 19 hours ago
This is a tabletop device that automatically picks up chips after dicing and packs them into trays. Compatible with a maximum wafer size of 12in, r...
Hugle Electronics Co., Ltd.
290+ people viewing
Last viewed: 12 hours ago
A grip ring used to hold the wafer in its expanded state. ■Product overview ・Easy to remove - Lighter, thinner and space-saving compared to conve...
Hugle Electronics Co., Ltd.
260+ people viewing
The HS-1840 wafer expansion device was developed from the customer's perspective, based on years of accumulated know-how and numerous sales results...
Hugle Electronics Co., Ltd.
500+ people viewing
Last viewed: 8 hours ago
This is a wafer expansion device equipped with a grip ring auto-clamp mechanism. The cutter mechanism built into the stage makes the tape skirt as ...
Hugle Electronics Co., Ltd.
460+ people viewing
Last viewed: 3 hours ago
This is a device that tape mounts wafers. Can be applied evenly without bubbles. (Supports up to 6 inch wafers) It is also possible to transfer waf...
Hugle Electronics Co., Ltd.
570+ people viewing
Mount the dicing frame and wafer on tape and cut. Can be applied evenly without bubbles. (Supports up to 8 inch wafers) It is also possible to tran...
Hugle Electronics Co., Ltd.
400+ people viewing
Last viewed: 1 day ago
Our unique method allows chips to be peeled off from the dicing tape without damaging the back side. ■Product overview ・Model 4800 chip/tape sepa...
Hugle Electronics Co., Ltd.
430+ people viewing
Last viewed: 1 day ago
A manual flip chip placement system with excellent ease of use and positioning accuracy. ■Product overview ・Manual X-Y sliding table ・Micrometer...
Hugle Electronics Co., Ltd.
570+ people viewing
Last viewed: 15 minutes ago
The new Model 865 Flip Chip Bonder can perform eutectic, ultrasonic, epoxy, thermocompression, and solder flip bonding in one system. It has evolve...
