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  4. Perform eutectic, ultrasonic, epoxy, thermocompression, and solder flip bonding in one system Flip Chip Bonder Model 865 (Hugle Electronics Co., Ltd.)
Perform eutectic, ultrasonic, epoxy, thermocompression, and solder flip bonding in one system Flip Chip Bonder Model 865-Model 865
Perform eutectic, ultrasonic, epoxy, thermocompression, and solder flip bonding in one system Flip Chip Bonder Model 865-Hugle Electronics Co., Ltd.

Perform eutectic, ultrasonic, epoxy, thermocompression, and solder flip bonding in one system Flip Chip Bonder Model 865
Hugle Electronics Co., Ltd.

Hugle Electronics Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

51.6hours

About This Product

The new Model 865 Flip Chip Bonder can perform eutectic, ultrasonic, epoxy, thermocompression, and solder flip bonding in one system. It has evolved into the best tool for R&D and low volume production.

■Product overview

・Can be equipped with a new dual camera vision system for ultra-high resolution ・High precision placement within 1μ ・Uses high-precision servo motor (Z drive) Automatic temperature control (stage/collet temperature) ・Bond weight can be selected ・Ultra-high precision linear scrub bond head ・Single or dual hot gas heating system ・Die pickup stage 4 inch tray, 2 inch tray, custom specifications available ・Bond weight, temperature profile, process time, and machine cycle are automatically controlled ・Rapid heating stage, normal heating stage and various cooling stages ・Heated die tool (collet) ・Preform tool ・Direct viewing microscope (optional)

  • Product

    Perform eutectic, ultrasonic, epoxy, thermocompression, and solder flip bonding in one system Flip Chip Bonder Model 865

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1 Models of Perform eutectic, ultrasonic, epoxy, thermocompression, and solder flip bonding in one system Flip Chip Bonder Model 865

Image Part Number Price (excluding tax) Power supply Weight Nitrogen Vacuum Compatible chip size Bonding accuracy Size Air
Perform eutectic, ultrasonic, epoxy, thermocompression, and solder flip bonding in one system Flip Chip Bonder Model 865-Part Number-Model 865

Model 865

Available upon quote

110V10A50/60Hz

165kg

0.28MPa

68kPa

~50mm

±0.5μm

914 (D) × 1,016 (W) × 914 (H) mm

0.42Mpa

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About Company Handling This Product

Hugle Electronics Co., Ltd.

Response Rate

100.0%

Response Time

51.6hrs

  • Japan

Related search keywords

Semiconductor Manufacturing Equipment Component & Part Machining
Semiconductor Manufacturing Equipment Component & Part Machining　Hugle Electronics Co., Ltd.
Hugle Electronics Co., Ltd.

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