Perform eutectic, ultrasonic, epoxy, thermocompression, and solder flip bonding in one system Flip Chip Bonder Model 865
Hugle Electronics Co., Ltd.
About This Product
The new Model 865 Flip Chip Bonder can perform eutectic, ultrasonic, epoxy, thermocompression, and solder flip bonding in one system. It has evolved into the best tool for R&D and low volume production.
■Product overview
・Can be equipped with a new dual camera vision system for ultra-high resolution
・High precision placement within 1μ
・Uses high-precision servo motor (Z drive) Automatic temperature control (stage/collet temperature)
・Bond weight can be selected
・Ultra-high precision linear scrub bond head
・Single or dual hot gas heating system
・Die pickup stage 4 inch tray, 2 inch tray, custom specifications available
・Bond weight, temperature profile, process time, and machine cycle are automatically controlled
・Rapid heating stage, normal heating stage and various cooling stages
・Heated die tool (collet)
・Preform tool
・Direct viewing microscope (optional)
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Product
Perform eutectic, ultrasonic, epoxy, thermocompression, and solder flip bonding in one system Flip Chip Bonder Model 865
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Handling Company
Hugle Electronics Co., Ltd.
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Categories
1 Models of Perform eutectic, ultrasonic, epoxy, thermocompression, and solder flip bonding in one system Flip Chip Bonder Model 865
| Product Image | Part Number | Price (excluding tax) | Air | Bonding accuracy | Compatible chip size | Nitrogen | Power supply | Size | Vacuum | Weight |
|---|---|---|---|---|---|---|---|---|---|---|
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Model 865 |
Available upon quote | 0.42Mpa | ±0.5μm | ~50mm | 0.28MPa | 110V10A50/60Hz | 914 (D) × 1,016 (W) × 914 (H) mm | 68kPa | 165kg |
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