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  4. Alloy-based heat dissipation board Cu-Mo (copper-molybdenum) (A.L.M.T. Corp.)
Alloy-based heat dissipation board Cu-Mo (copper-molybdenum)-CM-15
Alloy-based heat dissipation board Cu-Mo (copper-molybdenum)-A.L.M.T. Corp.

Alloy-based heat dissipation board Cu-Mo (copper-molybdenum)
A.L.M.T. Corp.

About This Product

■Product overview

A heat dissipation board that is easy to roll and press and has variable linear expansion coefficient and thermal conductivity. In addition, since the surface of the laminated material CPC is pure Cu, it has excellent initial heat dissipation effects on the surface. Allied Materials has a lineup of 10 types of Cu-Mo to meet customer needs.

■Application examples

Wireless communication, optical communication, automotive, wind power generation, LED, industrial machinery

■Features

CM-15: Cu-Mo with a low coefficient of thermal expansion, close to that of GaAs and GaN, controlling thermal expansion mismatch.

  • Product

    Alloy-based heat dissipation board Cu-Mo (copper-molybdenum)

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1 Models of Alloy-based heat dissipation board Cu-Mo (copper-molybdenum)

Image Part Number Price (excluding tax) Composition Thermal conductivity R.T. (W/ (m・K) ) Material Average linear expansion coefficient (ppm/K)
Alloy-based heat dissipation board Cu-Mo (copper-molybdenum)-Part Number-CM-15

CM-15

Available upon quote

85Mo-15Cu

148

Cu-Mo

R.T.~800℃：7.6

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About Company Handling This Product

A.L.M.T. Corp.

Company Overview

A.L.M.T. Corp., founded in Japan in 1939, is a manufacturer of heat spreaders, tungsten/molybdenum powder and ...

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  • Japan

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