Cut router type substrate split machine with low stress-MR2535H2

Cut router type substrate split machine with low stress
Meiryo Technica

🚗 Automotive & Transport Use 💻 Electronics & Electrical Use

Meiryo Technica's Response Status

Response Rate

100.0%

Response Time

35.7hours

About This Product

This device is a device that divides a large number of small and complex substrates by a router system.

Mitsubishi Electric We support the productivity and quality of the factory by design and production that makes full use of automation and IT technology cultivated in Nagoya Seisakusho.

■ Characteristics･ Cut the unnecessary part of the complex shape of the printed circuit board after implementation by the router bit.
･ Because the printed circuit board can be cut with low stress, it can reduce the risk of damage to implementation parts (such as a laminated ceramic capacitor) by stress in the conventional hand folding or press system.
･ Once disconnected, there is no burrs and the cut surface is beautiful, so there is no need to work such as a file.
-The cutting program created can be centrally managed on the server and switched multiple programs.
･ Connect to a higher -level production system and support driving data (operating time, split start / end time, equipment abnormal information, router bit life management, etc.). (E-F@Ctory compatible)
･ The settlement is improved by increasing the opening width of the equipment opening and closing door. *
･ The space saving is realized by built -in dust collector at the bottom of the equipment. *
･ The productivity is greatly improved by speeding up the moving speed of the X-Y axis (3 times the conventional Company). *
･ Since the position in the Z -axis direction can be set for each cutting point, the tact can be shortened. *
･ Cutting curves with demand in the medical and amusement fields can also be used by arc -interpolation function. *
･ By router bit life management, it will be automatically replaced before the router bit damage. (Optional) *
･ Jet utensils and substrate float detections can prevent the board damage due to jigs and board set mistakes. (Optional) *
･ By directly imaging the board with the image teaching function, you can set a cutting point in a short time *. In addition, you can also check parts interference in the Z -axial direction of the cutting point in the test operation mode. *
･ Even while the device is operating, you can set the cutting point and calculate the theoretical tact by the pre -imaged board image. (Optional) *

* Separate jigs corresponding to the printed circuit board to be cut are required.

■ What is E-F@Ctory compatible?A concept that realizes "next -generation manufacturing" by optimization of efficient and flexible manufacturing, production sites and the entire supply chain and engineering chain by coordination of people, machinery, and IT.

Model
There are 1 models for this product.

Product
Cut router type substrate split machine with low stress

Handling Company
Meiryo Technica

Categories

Machining / Machine Tools

Substrate Seperators

Machining / Machine Tools

Substrate Cutting Machines

Usage Scenarios
Automotive & Transport Use / Electronics & Electrical Use

520+ people viewing

Last viewed: 13 hours ago

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1 Models of Cut router type substrate split machine with low stress

Image	Part Number	Price (excluding tax)	Target board maximum size (vertical x horizontal)	Field handling board material	Basic handling plate thickness	Based handling position regulation method	Basic performance X-Y axial positioning method	Basic performance maximum cutting speed reference value	Basic performance X-Y axis movement speed	Basic performance repetitive positioning accuracy	Basic performance Z axis specification	Cutting tool collet size	Cutting tool router	Cutting tool spindle allowable rotation speed	Other standard specifications	Other device external dimensions (schematic)	Other device outstanding quality
	MR2535H2	Available upon quote	250mm x 350mm M size board compatible	Resin substrate such as glass epoxy (FR-4), CEM-3	0.4-2.0mm	Positioning by jigs	2 -axis AC servo control	100mm/s (router diameter ø3.0mm, plate thickness T = 0.4mm) (Recommended continuous use: 20mm/s or less)	Up to 1,200mm/s	± 0.01mm	AC servo drive 100mm stroke	ø3.175mm (1/8inch)	ø0.8 to 3.0mm installation available/Use a router bit in multiple stages to reduce running costs	60,000RPM (continuous use is recommended to 50,000RPM or less)	Bit omission / broken confirmation function, built -in small dust collection machine	790W x 970D x 1,670H (excluding display lights including touch panels)	Approximately 400kg

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About Company Handling This Product

Meiryo Technica

Response Rate

100.0%

Response Time

35.7hrs

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Cut router type substrate split machine with low stress Meiryo Technica

Meiryo Technica's Response Status

About This Product

■ Characteristics

■ What is E-F@Ctory compatible?

1 Models of Cut router type substrate split machine with low stress

MR2535H2

Customers who viewed this product also viewed

Other products of Meiryo Technica

About Company Handling This Product

Related search keywords

Cut router type substrate split machine with low stress
Meiryo Technica