Cut router type substrate split machine with low stress
Meiryo Technica

This device is a device that divides a large number of small and complex substrates by a router system. Mitsubishi Electric We support the productivity and quality of the factory by design and production that makes full use of automation and IT technology cultivated in Nagoya Seisakusho. ■ Characteristics ･ Cut the unnecessary part of the complex shape of the printed circuit board after implementation by the router bit. ･ Because the printed circuit board can be cut with low stress, it can reduce the risk of damage to implementation parts (such as a laminated ceramic capacitor) by stress in the conventional hand folding or press system. ･ Once disconnected, there is no burrs and the cut surface is beautiful, so there is no need to work such as a file. -The cutting program created can be centrally managed on the server and switched multiple programs. ･ Connect to a higher -level production system and support driving data (operating time, split start / end time, equipment abnormal information, router bit life management, etc.). (E-F@Ctory compatible) ･ The settlement is improved by increasing the opening width of the equipment opening and closing door. * ･ The space saving is realized by built -in dust collector at the bottom of the equipment. * ･ The productivity is greatly improved by speeding up the moving speed of the X-Y axis (3 times the conventional Company). * ･ Since the position in the Z -axis direction can be set for each cutting point, the tact can be shortened. * ･ Cutting curves with demand in the medical and amusement fields can also be used by arc -interpolation function. * ･ By router bit life management, it will be automatically replaced before the router bit damage. (Optional) * ･ Jet utensils and substrate float detections can prevent the board damage due to jigs and board set mistakes. (Optional) * ･ By directly imaging the board with the image teaching function, you can set a cutting point in a short time *. In addition, you can also check parts interference in the Z -axial direction of the cutting point in the test operation mode. * ･ Even while the device is operating, you can set the cutting point and calculate the theoretical tact by the pre -imaged board image. (Optional) * * Separate jigs corresponding to the printed circuit board to be cut are required. ■ What is E-F@Ctory compatible? A concept that realizes "next -generation manufacturing" by optimization of efficient and flexible manufacturing, production sites and the entire supply chain and engineering chain by coordination of people, machinery, and IT.