Heat dissipation/electromagnetic shielding resin molded product
Sekisui Techno Molding Co., Ltd.
About This Product
In addition to outstanding electromagnetic wave shielding properties, it has high heat dissipation properties and high plasticity. A resin molded product that not only provides heat radiation and diffusion, but also shields electromagnetic waves. Ideal for EMC measures for ECUs, modules with built-in microprocessors, and component cases. It is approximately 45% lighter than aluminum and can be used as housings/cases for in-vehicle cameras, millimeter wave radars, and ECUs. Since it is a resin material, it can be molded into any shape, eliminating polishing, anti-rust processing, bolt hole drilling, etc., and can be expected to significantly reduce processing costs.
■Main features
・Achieved electromagnetic shielding performance of 40dB or more and electromagnetic shielding rate of 99% or more. Excellent shielding performance in high frequency range.
・Has high heat diffusion performance in the horizontal (plane) direction, achieving a thermal conductivity of 14W/ (m･K).
・Compared to metals, resonance is less likely to occur, and even if it does occur, it can be suppressed to a slight resonance.
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Product
Heat dissipation/electromagnetic shielding resin molded product
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Handling Company
Sekisui Techno Molding Co., Ltd.
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Categories
1 Models of Heat dissipation/electromagnetic shielding resin molded product
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Heat dissipation/electromagnetic shielding resin molded product |
Available upon quote |
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