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■ Overview "Crystal Bond 555" is a new type of low -fuse thermoplastic hemophoraging. It is used to provide a wide range of electronic components dating, grinding, and backup blocks for polishing work. ■ Characteristics "Crystal Bond 555" is mainly composed of nonlefenol etoxilate and is used for adhesion of various materials such as ceramics, glass, and metal. It is ideal for filling the gaps and miso for temporary damage when performing a mechanical processing that does not have so much shearing. Typical applicants include dicing processing such as the pilotine vibrator, micro electronic material, ceramic green tape, semiconductor, and optical crystal, etc. from the electronic component industry. ■ How to use "Crystal bond 555" has a low melting point, so if you attach it to 48 ° C hot water, it will flow and it is easy to bond and remove. The membrane is thin and transparent, so you can observe the cross -sectional shape during work. * There is also a high-temperature type crystal bond 555-HMP with the same specifications with only 66 ° C.
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Crystal bond 555Handling Company
Edec Co., Ltd.Categories
| Image | Price (excluding tax) | Heat resistance upper limit (℃) | capacity |
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Available upon quote | 48 | White square bar [13x25x178mm] (set of 10, weighs 0.15 pounds (about 70g)), with plastic case |
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