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Applicable to various materials epoxy adhesive (organic)-Edec Co., Ltd.

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Model Description

■ Overview "Alem Cobond 2300" is a high -strength, low viscosity epoxy adhesive. It has high pulling strength and has excellent impact resistance and vibration resistance. ■ Characteristics The "Alem Cobond 2300" is a dual -liquid, white and translucent, low -viscosity type, increases heat resistance and tensile slick strength, has excellent impact resistance and vibration resistance. Excellent drug resistance to acid, alkaline, organic solvent, salt, etc. It is often used for adhesions such as thermoplastic engineering plastic and heat -resistant ceramic tiles used in the aviation and automotive industries. ■ How to use "Alem Cobond 2300" uses resin base B and hardening agent A at a weight ratio of 10: 1. After bonding, bake at 66 ° C for 2 hours for 2 hours or leave at room temperature for 48 hours.


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Birthday conditions that change to the left

Condensed volatile ingredients (CVCM)

Density (G/CM^3)

Distributed coefficient

Distribution rate (1.0kHz)

Dumpy strength (kgf/cm^2)

Escape force (kgf/cm^2)

Hardness after burning hardening

Heat expansion coefficient (CTE) (IN/IN/℃ x 10^-6)

Heat resistance upper limit (℃)

Insulation (KV/mm)

Insulation power (VOLTS/MIL)

Line contraction (%)

Mixed viscosity (CP)

Mixing ratio of resin and curing agent (weight ratio)

Pot life (100g amount @ 25 ℃)

Pull strength (PSI)

Recommended firing conditions

Total quality loss (TML)

Volume-fitted resistance value (ohms^-cm)

capacity

chemical resistance

color

Schrin cage (shrink rate) (mm/mm or in/in)

Heat expansion rate (in/in/℃)

Dealing dialogue (per 1kHz)

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  • Part Number

    Aremkobond 2300

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Applicable to various materials epoxy adhesive (organic) Aremkobond 2300's performance table

Image Price (excluding tax) Birthday conditions that change to the left Dealing dialogue (per 1kHz) Density (G/CM^3) Distributed coefficient Distribution rate (1.0kHz) Dumpy strength (kgf/cm^2) Escape force (kgf/cm^2) Hardness after burning hardening Heat expansion coefficient (CTE) (IN/IN/℃ x 10^-6) Heat resistance upper limit (℃) Insulation (KV/mm) Insulation power (VOLTS/MIL) Line contraction (%) Mixed viscosity (CP) Mixing ratio of resin and curing agent (weight ratio) Pot life (100g amount @ 25 ℃) Pull strength (PSI) Recommended firing conditions Schrin cage (shrink rate) (mm/mm or in/in) Volume-fitted resistance value (ohms^-cm) capacity chemical resistance color
Applicable to various materials epoxy adhesive (organic)-Part Number-Aremkobond 2300 Available upon quote Room temperature x 48hrs. 3.5 1.1 0.008 3.5 949 320.6 85 (Shore D hardness) 66 -55 ~ 175 14.96 380 0.3 5,000 100: 10 45min 4,560 66 ℃ x 2HRS. 0.003 1.0 × 10^15 1 Pint (≒ 500ml), 1 quote (≒ 1L) Excellent Milky white

There are 9 models for this product.

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