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Applicable to various materials epoxy adhesive (organic)-Edec Co., Ltd.

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Model Description

■ Overview The "Alem Cobond 570" is a highly heat -resistant epoxy adhesive of a single -liquid type, mainly used to glue copper nozzles to the ceramic insulation material of oxygen/acetylene weld torch. ■ Characteristics The most distinctive feature of "Alem Cobond 570" is that it is single -liquid (most of the epoxy adhesive is usually a two -liquid mixture). It is resistant to heat shock and has excellent water resistance and chemical resistance. ■ How to use The application method of "Alem Cobond 570" is applied with a plastic spatula or an automatic day spencer. Apply thinly to 0.2 to 0.3 mm membrane thickness to both sides of the wearing surface. After applying, dry at room temperature for 15 to 20 minutes, skip the solvent, then stick the aircraft, clamp and fix it. Then, at 82 ° C for 20 to 30 minutes, then fired for 20 to 30 minutes at 177 ° C. If you apply force immediately, it may come off. The "Alem Cobond 570", which has excellent adaptive power, can also be used for glue of materials such as ceramics, metals, plastic, quartz, and various fires resistance.


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Birthday conditions that change to the left

Condensed volatile ingredients (CVCM)

Density (G/CM^3)

Distributed coefficient

Distribution rate (1.0kHz)

Dumpy strength (kgf/cm^2)

Escape force (kgf/cm^2)

Hardness after burning hardening

Heat expansion coefficient (CTE) (IN/IN/℃ x 10^-6)

Heat resistance upper limit (℃)

Insulation (KV/mm)

Insulation power (VOLTS/MIL)

Line contraction (%)

Mixed viscosity (CP)

Mixing ratio of resin and curing agent (weight ratio)

Pot life (100g amount @ 25 ℃)

Pull strength (PSI)

Recommended firing conditions

Total quality loss (TML)

Volume-fitted resistance value (ohms^-cm)

capacity

chemical resistance

color

Schrin cage (shrink rate) (mm/mm or in/in)

Heat expansion rate (in/in/℃)

Dealing dialogue (per 1kHz)

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  • Part Number

    Aremkobond 570

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Applicable to various materials epoxy adhesive (organic) Aremkobond 570's performance table

Image Price (excluding tax) Birthday conditions that change to the left Density (G/CM^3) Escape force (kgf/cm^2) Heat expansion coefficient (CTE) (IN/IN/℃ x 10^-6) Heat expansion rate (in/in/℃) Heat resistance upper limit (℃) Insulation (KV/mm) Insulation power (VOLTS/MIL) Mixed viscosity (CP) Pull strength (PSI) Recommended firing conditions Volume-fitted resistance value (ohms^-cm) capacity chemical resistance color
Applicable to various materials epoxy adhesive (organic)-Part Number-Aremkobond 570 Available upon quote Room temperature x 24hrs. + 177 ℃ x 0.5HRS. 0.95 263.7 86 86 x 10^-6 -60 ~ 316 11.81 300 35,000 3,750 82 ℃ x 0.3hrs. + 177 ℃ x 0.2HRS. 1.0 × 10^13 1 Pint (≒ 500ml), 1 quote (≒ 1L) Excellent Black

There are 9 models for this product.

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