HP ceramic board | Shopping abrasive wrapping disc (free abrasive grain type)
Musashino Denshi, INC.
Price (excluding tax)
Model Description
Ideal for polishing ceramic samples and pollution sensitive samples. It is the best abrasive when you want to suppress the adhesion of metal powder. ■ Features ・ Finish polishing can be performed using abrasives from 0.5 µm to 3 µm. ・ Use to polish a sample that is unacceptable to adhere to metal materials. ・ Prevents edge, and can perform precision polishing with high flat degree. ■ Use ·ceramic ・ A sample that is unacceptable for contaminated (contamination) with metal materials ...
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Abrasive
Granularity
Material
Process
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Part Number
HP ceramic board
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Handling Company
Musashino Denshi, INC.
Shopping abrasive wrapping disc (free abrasive grain type) HP ceramic board's performance table
Items marked with have different values depending on the model number.
| Product Image | Price (excluding tax) | Abrasive | Granularity | Material | Process |
|---|---|---|---|---|---|
|
|
Available upon quote | Diamond slurry, diamond solution, WA abrasive, GC abrasive ... etc. | 0.5 μm ~ 3μm | Aluminum oxide | Finishing polishing |
There are 5 models for this product.
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About Company Handling This Product
- Japan
- Since 1977