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7.3hours
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■ Characteristics ・ Vaporiture ・ After applying a thin film metal membrane in a spatta, it is possible to use a wet process to 1 to 10 μm for copper and gold. ・ VIA fills and side metrasies can also be supported ・ Chip size 0.3mm × 0.6mm × 0.1t substrate can be supported
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Thin film ceramic substrateProduct
Ceramic substrateHandling Company
Noshimitsu Photo Service Co., Ltd.Categories
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Response Rate
100.0%
Response Time
7.3hrs