Substrate with bump
Noshimitsu Photo Service Co., Ltd.
About This Product
Unlike a metal -based board with a general structure, it is possible to partially form a convex (bump) of the base metal, expose the convex portion formed on the surface layer, and direct the heat dissipation of the heat generated parts directly to remove heat to the metal base board.
■ Characteristics
･ Long life of high power LED
･ Shortening of heat dissipation routes
■ Use
･ High power LED module
･ Effective utilization of heat dissipation pads (neutral poles)
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Product
Substrate with bump
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Handling Company
Noshimitsu Photo Service Co., Ltd.
1 Models of Substrate with bump
| Product Image | Part Number | Price (excluding tax) |
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Substrate with bump |
Available upon quote |
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About Company Handling This Product
Noshimitsu Photo Service Co., Ltd.
- Japan
- Since 1977
- 27 employees