Yamaha Robotics Holdings Co., Ltd.'s Semiconductor Manufacturing Equipment Component & Part Machining

■Summary ・Inherited the module concept of Apic Yamada's previous COMBO series ・Support for upsizing and matrix formation for the purpose of impro...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Summary Continuous furnace equipment that receives the frame after resin sealing and puts it into the furnace together with the magazine, performs...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Summary ・Package bonder compatible with Chip to Substrate's Thermal Compression Bonding (TCB) method ・Compatible with face down construction met...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Summary ・Package bonder compatible with Chip to Wafer's Thermal Compression Bonding (TCB) method ・Compatible with face down construction method ...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Summary ・Transfer molding equipment that can efficiently mass produce power semiconductors and large electronic devices ・Equipped with a large-s...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Summary ・Standard transfer mold system that inherits the previous model - Adopts new interface and control equipment. Ease of use and greater pre...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Summary ・Manual system for simple prototyping and mass production ・The press module uses AC servo motors for clamp and transfer drives to achiev...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Summary ・Ensuring advanced molding technology and stable quality ・Available from small quantity to mass production ・Supports various molding me...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Summary ・Manual system using the same molding machine as automatic machine ・Semiconductor packages, general electronic components, automotive el...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Features ・By using wire bonder UTC-5000 as a base, high-speed bonding of 30ms/bump is achieved. ・Equipped with a wafer rotation stage, it is pos...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Summary High precision twin head die bonder. A highly productive, space-saving, high-precision die bonder equipped with dual bonding heads. The au...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Summary ・High-speed, high-precision die bonder for small chips ・Compatible with eutectic, WBC/DAF, and epoxy processes ・This is a thermal eutec...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Summary ・High-speed Cu wire bonder that is the culmination of the series ・Upgraded version of multi-wire compatible model that supports Cu wire,...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Summary ・High-speed wire bonder that is the culmination of the series ・Upgraded version of basic model for gold wire bonding ・Improve device fu...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Summary ・High-speed Cu wire bonder that is the culmination of the series ・Upgraded version of wide frame compatible model compatible with 100mm ...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Summary High-speed wire bonder compatible with wide frames and suitable for LED and discrete production. ■Features - Renewed X, Y, and Z motors f...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining