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5 products found
Japan Engis Co., Ltd.
280+ people viewing
The auto stirrer continues to stir the slurry while the wrapping machine is operating, which prevents diamond precipitation and improves the disper...
Japan Engis Co., Ltd.
440+ people viewing
Last viewed: 5 minutes ago
EBM-250HCD is a device designed and developed for bonding wafers and bonding plates (ceramic plates). Solid wax is liquefied and a dispenser suppli...
Japan Engis Co., Ltd.
220+ people viewing
Last viewed: 4 minutes ago
The bonding equipment HWB series is a simple bonding equipment used in a wide range of fields. The cooling table is equipped with a water jacket, ...
Japan Engis Co., Ltd.
360+ people viewing
Last viewed: 4 minutes ago
Minimizer EMC-3 allows you to precisely set the spray time and supply amount of diamond slurry and lubricant to match the lapping cycle. Since the ...
Japan Engis Co., Ltd.
300+ people viewing
Last viewed: 1 hour ago
The diamond electrodeposition correction ring is a correction ring for quickly correcting the flatness of high press surface plates. You can choose...
