Japan Engis Co., Ltd.'s Semiconductor Manufacturing Equipment Component & Part Machining

The auto stirrer continues to stir the slurry while the wrapping machine is operating, which prevents diamond precipitation and improves the disper...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

EBM-250HCD is a device designed and developed for bonding wafers and bonding plates (ceramic plates). Solid wax is liquefied and a dispenser suppli...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

The bonding equipment HWB series is a simple bonding equipment used in a wide range of fields. The cooling table is equipped with a water jacket, ...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

Minimizer EMC-3 allows you to precisely set the spray time and supply amount of diamond slurry and lubricant to match the lapping cycle. Since the ...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

The diamond electrodeposition correction ring is a correction ring for quickly correcting the flatness of high press surface plates. You can choose...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining