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Ars Co., Ltd.'s Semiconductor Manufacturing Equipment Component & Part Machining

Ars Co., Ltd.

12 products found

Ars Co., Ltd.

Back grinder/laser grooving

80+ people viewing

Response Rate
100.0 %
Response Time
43.9 hours

■Optimal wafer test environment that covers a wide range In the wafer test process, we conduct electrical tests on the wafers received from our cus...

Ars Co., Ltd.

Semiconductor/MEMS packaging DFN (Dual Flat No Lead: Non-lead/Cu frame)

160+ people viewing

Last viewed: 2 hours ago

Response Rate
100.0 %
Response Time
43.9 hours

Creating the future with packaging production technology ■We are not only a contract production base for semiconductor/MEMS packages, but also a t...

Ars Co., Ltd.

Laser trimming

80+ people viewing

Last viewed: 11 hours ago

Response Rate
100.0 %
Response Time
43.9 hours

■Optimal wafer test environment that covers a wide range In the wafer test process, we conduct electrical tests on the wafers received from our cus...

Ars Co., Ltd.

Semiconductor/MEMS packaging LNC (Lead Number Choose: Non-lead glass epoxy substrate)

130+ people viewing

Last viewed: 1 day ago

Response Rate
100.0 %
Response Time
43.9 hours

Creating the future with packaging production technology ■We are not only a contract production base for semiconductor/MEMS packages, but also a t...

Ars Co., Ltd.

Semiconductor/MEMS packaging MCM (Multi Chip Module: non-lead glass epoxy substrate)

110+ people viewing

Last viewed: 19 hours ago

Response Rate
100.0 %
Response Time
43.9 hours

Creating the future with packaging production technology ■We are not only a contract production base for semiconductor/MEMS packages, but also a t...

Ars Co., Ltd.

Semiconductor/MEMS packaging QFN (Quad Flat Non-leaded: Non-lead glass epoxy substrate)

150+ people viewing

Last viewed: 1 hour ago

Response Rate
100.0 %
Response Time
43.9 hours

Creating the future with packaging production technology ■We are not only a contract production base for semiconductor/MEMS packages, but also a t...

Ars Co., Ltd.

Semiconductor/MEMS packaging SOP (lead package/Cu frame)

130+ people viewing

Last viewed: 44 minutes ago

Response Rate
100.0 %
Response Time
43.9 hours

Creating the future with packaging production technology ■We are not only a contract production base for semiconductor/MEMS packages, but also a t...

Ars Co., Ltd.

Semiconductor/MEMS packaging SOT-23 (Lead package/Cu frame)

100+ people viewing

Last viewed: 39 minutes ago

Response Rate
100.0 %
Response Time
43.9 hours

Creating the future with packaging production technology ■We are not only a contract production base for semiconductor/MEMS packages, but also a t...

Ars Co., Ltd.

Semiconductor/MEMS packaging SOT-89 (Lead package/Cu frame)

140+ people viewing

Last viewed: 40 minutes ago

Response Rate
100.0 %
Response Time
43.9 hours

Creating the future with packaging production technology ■We are not only a contract production base for semiconductor/MEMS packages, but also a t...

Ars Co., Ltd.

Semiconductor/MEMS packaging USB-A (Ultra Small Board: non-lead glass epoxy board)

150+ people viewing

Last viewed: 22 hours ago

Response Rate
100.0 %
Response Time
43.9 hours

Creating the future with packaging production technology ■We are not only a contract production base for semiconductor/MEMS packages, but also a t...

Ars Co., Ltd.

Semiconductor/MEMS packaging USB-B (Ultra Small Board: Non-lead/Ni electroforming transfer lead)

110+ people viewing

Last viewed: 21 hours ago

Response Rate
100.0 %
Response Time
43.9 hours

Creating the future with packaging production technology ■We are not only a contract production base for semiconductor/MEMS packages, but also a t...

Ars Co., Ltd.

Semiconductor/MEMS packaging USB-C (Ultra Small Board: non-lead/Cu frame)

120+ people viewing

Last viewed: 38 minutes ago

Response Rate
100.0 %
Response Time
43.9 hours

Creating the future with packaging production technology ■We are not only a contract production base for semiconductor/MEMS packages, but also a t...


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