Hugle Electronics Co., Ltd.'s Semiconductor Manufacturing Equipment Component & Part Machining

Hugle Electronics Co., Ltd.

11 products found

Hugle Electronics Co., Ltd.

Wafer transfer machine compatible with both 6 and 8 inch wafers and SEMI standard wafer Automatic wafer transfer machine

90+ people viewing

Last viewed: 1 day ago

Response Rate
100.0 %

Response Time
51.6 hours

This device is a wafer transfer machine compatible with both 6 and 8 inch wafers and SEMI standard wafers. The automatic carrier identification fun...

Hugle Electronics Co., Ltd.

Tabletop device that automatically picks up chips after dicing and packs them into trays Supports a maximum wafer size of 8 inches Die sorter CT-200

110+ people viewing

Last viewed: 1 day ago

Response Rate
100.0 %

Response Time
51.6 hours

This is a tabletop device that automatically picks up chips after dicing and packs them into trays. Compatible with a maximum wafer size of 8in, re...

Hugle Electronics Co., Ltd.

Die sorter CT-300 is a tabletop device that automatically picks up chips after dicing and packs them into trays.

150+ people viewing

Last viewed: 1 day ago

Response Rate
100.0 %

Response Time
51.6 hours

This is a tabletop device that automatically picks up chips after dicing and packs them into trays. Compatible with a maximum wafer size of 12in, r...

Hugle Electronics Co., Ltd.

Grip ring used to maintain the expanded state of the wafer

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Last viewed: 1 day ago

Response Rate
100.0 %

Response Time
51.6 hours

A grip ring used to hold the wafer in its expanded state. ■Product overview ・Easy to remove - Lighter, thinner and space-saving compared to conve...

Hugle Electronics Co., Ltd.

HS-1840 is a device with excellent ease of use, precision, and versatility that uses a motor-driven stage.

70+ people viewing

Last viewed: 20 hours ago

Response Rate
100.0 %

Response Time
51.6 hours

The HS-1840 wafer expansion device was developed from the customer's perspective, based on years of accumulated know-how and numerous sales results...

Hugle Electronics Co., Ltd.

Wafer expansion device with grip ring auto-clamp mechanism HS-1840-AC

110+ people viewing

Last viewed: 3 hours ago

Response Rate
100.0 %

Response Time
51.6 hours

This is a wafer expansion device equipped with a grip ring auto-clamp mechanism. The cutter mechanism built into the stage makes the tape skirt as ...

Hugle Electronics Co., Ltd.

Wafer tape mounting device HS-7600 enables uniform attachment without bubbles

90+ people viewing

Last viewed: 9 hours ago

Response Rate
100.0 %

Response Time
51.6 hours

This is a device that tape mounts wafers. Can be applied evenly without bubbles. (Supports up to 6 inch wafers) It is also possible to transfer waf...

Hugle Electronics Co., Ltd.

Mount the dicing frame and wafer on tape and cut. Enables uniform attachment without bubbles. HS-7800

140+ people viewing

Last viewed: 9 hours ago

Response Rate
100.0 %

Response Time
51.6 hours

Mount the dicing frame and wafer on tape and cut. Can be applied evenly without bubbles. (Supports up to 8 inch wafers) It is also possible to tran...

Hugle Electronics Co., Ltd.

Peel the diced chips from the dicing tape without damaging the backside Chip/Tape Separator Model 4800

70+ people viewing

Response Rate
100.0 %

Response Time
51.6 hours

Our unique method allows chips to be peeled off from the dicing tape without damaging the back side. ■Product overview ・Model 4800 chip/tape sepa...

Hugle Electronics Co., Ltd.

Manual flip chip placement system Model 850 with excellent ease of use and positioning accuracy

80+ people viewing

Last viewed: 15 hours ago

Response Rate
100.0 %

Response Time
51.6 hours

A manual flip chip placement system with excellent ease of use and positioning accuracy. ■Product overview ・Manual X-Y sliding table ・Micrometer...

Hugle Electronics Co., Ltd.

Perform eutectic, ultrasonic, epoxy, thermocompression, and solder flip bonding in one system Flip Chip Bonder Model 865

110+ people viewing

Last viewed: 1 day ago

Response Rate
100.0 %

Response Time
51.6 hours

The new Model 865 Flip Chip Bonder can perform eutectic, ultrasonic, epoxy, thermocompression, and solder flip bonding in one system. It has evolve...

Check the product list of Hugle Electronics Co., Ltd.

Hugle Electronics Co., Ltd.'s Semiconductor Manufacturing Equipment Component & Part Machining

Wafer transfer machine compatible with both 6 and 8 inch wafers and SEMI standard wafer Automatic wafer transfer machine

Tabletop device that automatically picks up chips after dicing and packs them into trays Supports a maximum wafer size of 8 inches Die sorter CT-200

Die sorter CT-300 is a tabletop device that automatically picks up chips after dicing and packs them into trays.

Grip ring used to maintain the expanded state of the wafer

HS-1840 is a device with excellent ease of use, precision, and versatility that uses a motor-driven stage.

Wafer expansion device with grip ring auto-clamp mechanism HS-1840-AC

Wafer tape mounting device HS-7600 enables uniform attachment without bubbles

Mount the dicing frame and wafer on tape and cut. Enables uniform attachment without bubbles. HS-7800

Peel the diced chips from the dicing tape without damaging the backside Chip/Tape Separator Model 4800

Manual flip chip placement system Model 850 with excellent ease of use and positioning accuracy

Perform eutectic, ultrasonic, epoxy, thermocompression, and solder flip bonding in one system Flip Chip Bonder Model 865

Related Categories for Semiconductor Manufacturing Equipment Component & Part Machining