Hugle Electronics Co., Ltd.'s Semiconductor Manufacturing Equipment Component & Part Machining
Hugle Electronics Co., Ltd.11 products found
Hugle Electronics Co., Ltd.
Wafer transfer machine compatible with both 6 and 8 inch wafers and SEMI standard wafer Automatic wafer transfer machine
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Last viewed: 1 day ago
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This device is a wafer transfer machine compatible with both 6 and 8 inch wafers and SEMI standard wafers. The automatic carrier identification fun...
Hugle Electronics Co., Ltd.
Tabletop device that automatically picks up chips after dicing and packs them into trays Supports a maximum wafer size of 8 inches Die sorter CT-200
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Last viewed: 1 day ago
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100.0% Response Rate
0.7hours Response Time
This is a tabletop device that automatically picks up chips after dicing and packs them into trays. Compatible with a maximum wafer size of 8in, re...
Hugle Electronics Co., Ltd.
Die sorter CT-300 is a tabletop device that automatically picks up chips after dicing and packs them into trays.
20+ people viewing
very fast response<
100.0% Response Rate
0.7hours Response Time
This is a tabletop device that automatically picks up chips after dicing and packs them into trays. Compatible with a maximum wafer size of 12in, r...
Hugle Electronics Co., Ltd.
Grip ring used to maintain the expanded state of the wafer
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A grip ring used to hold the wafer in its expanded state. ■Product overview ・Easy to remove - Lighter, thinner and space-saving compared to conve...
Hugle Electronics Co., Ltd.
HS-1840 is a device with excellent ease of use, precision, and versatility that uses a motor-driven stage.
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Last viewed: 22 hours ago
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The HS-1840 wafer expansion device was developed from the customer's perspective, based on years of accumulated know-how and numerous sales results...
Hugle Electronics Co., Ltd.
Wafer expansion device with grip ring auto-clamp mechanism HS-1840-AC
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Last viewed: 1 day ago
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This is a wafer expansion device equipped with a grip ring auto-clamp mechanism. The cutter mechanism built into the stage makes the tape skirt as ...
Hugle Electronics Co., Ltd.
Wafer tape mounting device HS-7600 enables uniform attachment without bubbles
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0.7hours Response Time
This is a device that tape mounts wafers. Can be applied evenly without bubbles. (Supports up to 6 inch wafers) It is also possible to transfer waf...
Hugle Electronics Co., Ltd.
Mount the dicing frame and wafer on tape and cut. Enables uniform attachment without bubbles. HS-7800
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100.0% Response Rate
0.7hours Response Time
Mount the dicing frame and wafer on tape and cut. Can be applied evenly without bubbles. (Supports up to 8 inch wafers) It is also possible to tran...
Hugle Electronics Co., Ltd.
Peel the diced chips from the dicing tape without damaging the backside Chip/Tape Separator Model 4800
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Last viewed: 13 hours ago
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0.7hours Response Time
Our unique method allows chips to be peeled off from the dicing tape without damaging the back side. ■Product overview ・Model 4800 chip/tape sepa...
Hugle Electronics Co., Ltd.
Manual flip chip placement system Model 850 with excellent ease of use and positioning accuracy
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Last viewed: 7 minutes ago
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A manual flip chip placement system with excellent ease of use and positioning accuracy. ■Product overview ・Manual X-Y sliding table ・Micrometer...
Hugle Electronics Co., Ltd.
Perform eutectic, ultrasonic, epoxy, thermocompression, and solder flip bonding in one system Flip Chip Bonder Model 865
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very fast response<
100.0% Response Rate
0.7hours Response Time
The new Model 865 Flip Chip Bonder can perform eutectic, ultrasonic, epoxy, thermocompression, and solder flip bonding in one system. It has evolve...
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