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Kosaka Laboratory Ltd.'s Semiconductor Manufacturing Equipment Component & Part Machining

Kosaka Laboratory Ltd.

4 products found

Kosaka Laboratory Ltd.

Die bonder TR-100 series

140+ people viewing

Last viewed: 1 day ago

■Features The TR-100 series achieves high precision and high speed. We can respond flexibly by combining units such as development, prototyping, an...

Kosaka Laboratory Ltd.

Die bonder LD manufacturing equipment KFA-11

160+ people viewing

Last viewed: 5 hours ago

■Features This is LD manufacturing equipment that can be used for both LD chips and PD chips. Application: LD manufacturing

Kosaka Laboratory Ltd.

Die bonder LD manufacturing equipment PD die bonder

150+ people viewing

Last viewed: 17 hours ago

■Features High precision type die bonder for PD chip mounting. Application: LD manufacturing

Kosaka Laboratory Ltd.

Die bonder resin coating equipment

130+ people viewing

Last viewed: 31 minutes ago

■Features Resin coating equipment is a device that injects a certain amount of resin into packages such as LED substrates using a dispenser. The tr...


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