Kosaka Laboratory Ltd.'s Semiconductor Manufacturing Equipment Component & Part Machining

4 products found

Kosaka Laboratory Ltd.

Die bonder TR-100 series

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■Features The TR-100 series achieves high precision and high speed. We can respond flexibly by combining units such as development, prototyping, an...

Kosaka Laboratory Ltd.

Die bonder LD manufacturing equipment KFA-11

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■Features This is LD manufacturing equipment that can be used for both LD chips and PD chips. Application: LD manufacturing

Kosaka Laboratory Ltd.

Die bonder LD manufacturing equipment PD die bonder

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■Features High precision type die bonder for PD chip mounting. Application: LD manufacturing

Kosaka Laboratory Ltd.

Die bonder resin coating equipment

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■Features Resin coating equipment is a device that injects a certain amount of resin into packages such as LED substrates using a dispenser. The tr...

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Kosaka Laboratory Ltd.'s Semiconductor Manufacturing Equipment Component & Part Machining

Die bonder TR-100 series

Die bonder LD manufacturing equipment KFA-11

Die bonder LD manufacturing equipment PD die bonder

Die bonder resin coating equipment

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