Panasonic Industry Co., Ltd.'s Printed Circuit Boards

34 products found

Panasonic Industry Co., Ltd.

Semiconductor device materials Substrate materials for semiconductor packages “LEXCM GX” series Low thermal expansion semiconductor package substrate materials R-1515A

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■Substrate material for semiconductor packages “LEXCM GX” series Achieving thinner, smaller, and less warped semiconductor packages ■Low thermal e...

Panasonic Industry Co., Ltd.

Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages Low thermal expansion, high mounting reliability semiconductor package substrate materials

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Last viewed: 1 day ago

■Substrate material for semiconductor packages “LEXCM GX” series Achieving thinner, smaller, and less warped semiconductor packages ■Low thermal e...

Panasonic Industry Co., Ltd.

Semiconductor device materials Substrate materials for semiconductor packages “LEXCM GX” series High elasticity/low thermal expansion semiconductor package substrate materials R-1515W

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■Substrate material for semiconductor packages “LEXCM GX” series Achieving thinner, smaller, and less warped semiconductor packages ■High elastici...

Panasonic Industry Co., Ltd.

Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages High elasticity, low thermal expansion, and ultra-thin semiconductor package substrate materials

100+ people viewing

Last viewed: 1 day ago

■Substrate material for semiconductor packages “LEXCM GX” series Achieving thinner, smaller, and less warped semiconductor packages ■High elastici...

Panasonic Industry Co., Ltd.

Halogen-free glass epoxy multilayer board material "Halogen-free" series

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■Halogen-free glass epoxy multilayer board material “Halogen-free” series ・An environmentally friendly board material with excellent heat resistan...

Panasonic Industry Co., Ltd.

Halogen-free glass epoxy multilayer board material "Halogen-free" series R-1566S

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■Halogen-free glass epoxy multilayer board material “Halogen-free” series ・An environmentally friendly board material with excellent heat resistan...

Panasonic Industry Co., Ltd.

Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment "MEGTRON" series MEGTRON2 R-1577

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■Multilayer board material “MEGTRON” series for ICT infrastructure equipment ・Multilayer substrate material that supports high-capacity, high-spee...

Panasonic Industry Co., Ltd.

Glass epoxy substrate material R-1705

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■Glass epoxy board material A substrate material that achieves excellent substrate processability and is suitable for many uses. ■Glass epoxy doub...

Panasonic Industry Co., Ltd.

Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755D

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■Multilayer substrate material “HIPER” series for in-vehicle equipment ・Multilayer board material with excellent reliability and high heat resista...

Panasonic Industry Co., Ltd.

Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755E

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■Multilayer substrate material “HIPER” series for in-vehicle equipment ・Multilayer board material with excellent reliability and high heat resista...

Panasonic Industry Co., Ltd.

Electronic circuit board material Multilayer board material for automotive equipment “HIPER” series R-1755M

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■Multilayer substrate material “HIPER” series for in-vehicle equipment ・Multilayer board material with excellent reliability and high heat resista...

Panasonic Industry Co., Ltd.

Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755V

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■Multilayer substrate material “HIPER” series for in-vehicle equipment ・Multilayer board material with excellent reliability and high heat resista...

Panasonic Industry Co., Ltd.

Glass epoxy substrate material R-1766

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■Glass epoxy multilayer board material A substrate material that achieves excellent substrate processability and is suitable for many uses. ■Glass...

Panasonic Industry Co., Ltd.

Glass composite substrate material R-1785

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■Glass composite substrate material ・A board material that achieves the industry's highest level of safety and security performance and excellent ...

Panasonic Industry Co., Ltd.

Glass composite substrate material

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Last viewed: 21 hours ago

■Glass composite substrate material ・A board material that achieves the industry's highest level of safety and security performance and excellent ...

Panasonic Industry Co., Ltd.

Glass composite board material Thick copper foil glass composite board material R-1786

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■Glass composite substrate material ・A board material that achieves the industry's highest level of safety and security performance and excellent ...

Panasonic Industry Co., Ltd.

Heat countermeasure parts Electronic circuit board materials LED lighting board materials "ECOOL" series

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Last viewed: 1 day ago

■Product overview ・Substrate materials that provide solutions suitable for customers' various heat dissipation applications. ・Achieves ease of pr...

Panasonic Industry Co., Ltd.

Halogen-free glass epoxy multilayer board material "Halogen-free" series R-3566D

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■Halogen-free glass epoxy multilayer board material “Halogen-free” series ・An environmentally friendly board material with excellent heat resistan...

Panasonic Industry Co., Ltd.

Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment "MEGTRON" series Halogen-free MEGTRON6

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Last viewed: 21 hours ago

■Multilayer board material “MEGTRON” series for ICT infrastructure equipment ・Multilayer substrate material that supports high-capacity, high-spee...

Panasonic Industry Co., Ltd.

Electronic circuit board material High frequency board material for wireless communication equipment "XPEDION" series Halogen-free ultra-low transmission loss multilayer board material XPEDION1

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■High-frequency board material “XPEDION” series for wireless communication equipment Achieves low transmission loss in high frequency range ■Halog...

Panasonic Industry Co., Ltd.

Electronic circuit board materials High frequency board materials for wireless communication equipment "XPEDION" series XPEDION T1

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■High-frequency board material “XPEDION” series for wireless communication equipment Achieves low transmission loss in high frequency range ■High ...

Panasonic Industry Co., Ltd.

Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment "MEGTRON" series MEGTRON4S, MEGTRON4

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Last viewed: 1 day ago

■Multilayer board material “MEGTRON” series for ICT infrastructure equipment ・Multilayer substrate material that supports high-capacity, high-spee...

Panasonic Industry Co., Ltd.

Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment “MEGTRON” series MEGTRON M R-5735

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■Multilayer board material “MEGTRON” series for ICT infrastructure equipment ・Multilayer substrate material that supports high-capacity, high-spee...

Panasonic Industry Co., Ltd.

Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment “MEGTRON” series MEGTRON6

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■Multilayer board material “MEGTRON” series for ICT infrastructure equipment ・Multilayer substrate material that supports high-capacity, high-spee...

Panasonic Industry Co., Ltd.

Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment “MEGTRON” series MEGTRON7

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■Multilayer board material “MEGTRON” series for ICT infrastructure equipment ・Multilayer substrate material that supports high-capacity, high-spee...

Panasonic Industry Co., Ltd.

Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment "MEGTRON" series MEGTRON8S, MEGTRON8

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■Multilayer board material “MEGTRON” series for ICT infrastructure equipment ・Multilayer substrate material that supports high-capacity, high-spee...

Panasonic Industry Co., Ltd.

Paper phenolic substrate material

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■Paper phenolic substrate material ・Substrate material suitable for high-density packaging products due to its excellent electrical fire safety an...

Panasonic Industry Co., Ltd.

Halogen-free glass epoxy multilayer board material "Halogen-free" series R-A555 (W)

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■Halogen-free glass epoxy multilayer board material “Halogen-free” series ・An environmentally friendly board material with excellent heat resistan...

Panasonic Industry Co., Ltd.

Electronic circuit board material Flexible board material for mobile devices "FELIOS" series FELIOS R-BM17

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Last viewed: 4 hours ago

■Flexible substrate material “FELIOS” series for mobile devices Flexible substrate materials that meet the various mounting needs of mobile devices...

Panasonic Industry Co., Ltd.

Electronic circuit board materials Flexible board materials for mobile devices "FELIOS" series FELIOS LCP R-F705S

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Last viewed: 25 minutes ago

■Flexible substrate material “FELIOS” series for mobile devices Flexible substrate materials that meet the various mounting needs of mobile devices...

Panasonic Industry Co., Ltd.

Electronic circuit board material Flexible board material for mobile devices "FELIOS" series R-F775

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■Flexible substrate material “FELIOS” series for mobile devices Flexible substrate materials that meet the various mounting needs of mobile devices...

Panasonic Industry Co., Ltd.

Electronic circuit board materials Flexible board materials for mobile devices “FELIOS” series FELIOS FRCC

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■Flexible substrate material “FELIOS” series for mobile devices Flexible substrate materials that meet the various mounting needs of mobile devices...

Panasonic Industry Co., Ltd.

Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages Low thermal expansion and ultra-thin semiconductor package substrate materials

70+ people viewing

Last viewed: 2 hours ago

■Substrate material for semiconductor packages “LEXCM GX” series Achieving thinner, smaller, and less warped semiconductor packages ■Low thermal e...

Panasonic Industry Co., Ltd.

Semiconductor device materials “LEXCM GX” series of substrate materials for semiconductor packages Ultra-low loss materials for semiconductor packages and module substrates

90+ people viewing

Last viewed: 23 hours ago

■Substrate material for semiconductor packages “LEXCM GX” series Achieving thinner, smaller, and less warped semiconductor packages ■Ultra-low los...

Check the product list of Panasonic Industry Co., Ltd.

Panasonic Industry Co., Ltd.'s Printed Circuit Boards

Semiconductor device materials Substrate materials for semiconductor packages “LEXCM GX” series Low thermal expansion semiconductor package substrate materials R-1515A

Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages Low thermal expansion, high mounting reliability semiconductor package substrate materials

Semiconductor device materials Substrate materials for semiconductor packages “LEXCM GX” series High elasticity/low thermal expansion semiconductor package substrate materials R-1515W

Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages High elasticity, low thermal expansion, and ultra-thin semiconductor package substrate materials

Halogen-free glass epoxy multilayer board material "Halogen-free" series

Halogen-free glass epoxy multilayer board material "Halogen-free" series R-1566S

Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment "MEGTRON" series MEGTRON2 R-1577

Glass epoxy substrate material R-1705

Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755D

Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755E

Electronic circuit board material Multilayer board material for automotive equipment “HIPER” series R-1755M

Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755V

Glass epoxy substrate material R-1766

Glass composite substrate material R-1785

Glass composite substrate material

Glass composite board material Thick copper foil glass composite board material R-1786

Heat countermeasure parts Electronic circuit board materials LED lighting board materials "ECOOL" series

Halogen-free glass epoxy multilayer board material "Halogen-free" series R-3566D

Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment "MEGTRON" series Halogen-free MEGTRON6

Electronic circuit board material High frequency board material for wireless communication equipment "XPEDION" series Halogen-free ultra-low transmission loss multilayer board material XPEDION1

Electronic circuit board materials High frequency board materials for wireless communication equipment "XPEDION" series XPEDION T1

Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment "MEGTRON" series MEGTRON4S, MEGTRON4

Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment “MEGTRON” series MEGTRON M R-5735

Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment “MEGTRON” series MEGTRON6

Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment “MEGTRON” series MEGTRON7

Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment "MEGTRON" series MEGTRON8S, MEGTRON8

Paper phenolic substrate material

Halogen-free glass epoxy multilayer board material "Halogen-free" series R-A555 (W)

Electronic circuit board material Flexible board material for mobile devices "FELIOS" series FELIOS R-BM17

Electronic circuit board materials Flexible board materials for mobile devices "FELIOS" series FELIOS LCP R-F705S

Electronic circuit board material Flexible board material for mobile devices "FELIOS" series R-F775

Electronic circuit board materials Flexible board materials for mobile devices “FELIOS” series FELIOS FRCC

Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages Low thermal expansion and ultra-thin semiconductor package substrate materials

Semiconductor device materials “LEXCM GX” series of substrate materials for semiconductor packages Ultra-low loss materials for semiconductor packages and module substrates

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