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Ihara Electronics Industry Co., Ltd.
390+ people viewing
The build-up structure, in which the body layers are stacked one at a time and the laser VIA is used to connect the layers, greatly reduces the amo...
Ihara Electronics Industry Co., Ltd.
460+ people viewing
Last viewed: 3 hours ago
By using non-penetrating through holes (IVH/BVH), it is possible to increase the density and downsize the board.