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This section provides an overview for ic trays as well as their applications and principles. Also, please take a look at the list of 10 ic tray manufacturers and their company rankings. Here are the top-ranked ic tray companies as of December, 2024: 1.TopLine, 2.RH Murphy Company, Inc., 3.Mishima Kosan Co.,Ltd..
Table of Contents
An IC tray is a special container used to safely transport, inspect, store, and ship semiconductor IC packages.
IC packages come in various external shapes, including SOPs and QFPs with lead frames protruding from the sides of the package, BGAs with solder arranged in a grid pattern on the bottom of the package, and PGAs with pins arranged in a grid pattern on the bottom of the package.
In order to handle IC packages safely, it is important to use the appropriate IC tray, taking into consideration the type and size of the package and the location where it is used.
IC Trays are used in the back-end process of semiconductor manufacturing plants, where chips on silicon wafers are separated and packaged.
After the process of encapsulating chips in packages, IC packages are packed in IC trays and transported to the inspection process. After the inspection, the IC packages are stored and shipped in the IC trays.
In this way, IC trays are always used in the packaging process at semiconductor manufacturing plants.
Semiconductor products are generally susceptible to ESD damage caused by static electricity.
In addition, during the reflow process of mounting semiconductor ICs on boards, if moisture is contained inside the IC package, the heat during reflow may cause the moisture inside to expand and destroy the mold resin. Semiconductor ICs are mounted on the board to remove moisture.
JEDEC standard trays, which conform to JEDEC (Joint Electron Device Engineering Council) standards, are available as IC trays that meet these requirements.
JEDEC standard trays guarantee characteristics such as heat resistance and anti-static measures.
JEDEC standard trays are available in various external sizes according to the type and size of IC packages. However, one of the corners is cut at a 45° angle so that the single pin position of the IC can be identified. Therefore, ICs can be picked up and fed directly into JEDEC-standard equipment, thereby improving production efficiency.
*Including some distributors, etc.
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RH Murphy Company, Inc. is a manufacturing company founded in 1982 that develops and produces protective packaging products for semiconductors and electronic components, headquartered in the United States. The company has invented and supplied much-needed products to support manufacturing, testing, and shipment of semiconductor devices, integrated circuits, sensors, and a growing range of electronic components. Groundbreaking designs for JEDEC matrix trays and carriers have been awarded numerous patents worldwide. Its experience with plastics engineering, JEDEC tray, matrix tray, ESD management, and flexible manufacturing gives it the knowledge and tools to provide and meet customers specifications and need.
TopLine Corporation, founded in 1989 and headquartered in Milledgeville, Georgia, United States, engineers, manufactures, and researches across fields of defense and aerospace to solve problems. The company's products include Daisy Chain semiconductor test components, zero-ohm PCB jumpers, and engineering evaluation kits for experimentation. These products are used as dummy components to refine SMT assembly processes, including solder training, temperature profiling, and prototyping design. It serves educational institutions and research and development laboratories.
Mishima Kosan Co., Ltd., established in 1916 and headquartered in Fukuoka, Japan, is a manufacturer that specializes in process contracts, construction/engineering, plant engineering, and more. The company has a diverse product line, including Automation equipment engineering, Printing presses, Semiconductor manufacturing machines, Control valves, and more. It also provides automotive parts manufacturing and logistics business, and dispatching and welfare business. Its product can be easily modified or expanded to accommodate increased or adjusted demand. It has achieved ISO 9001 and ISO 14001 certification and obtained OHSAS 18001 certification. It serves industries such as Electroforming technologies, Aerospace, Liquid crystal industry, and more.
Kostat Inc., founded in 1979 and headquartered in Gyeonggi-do, South Korea, is a manufacturer and distributor of electrostatic discharge devices and equipment with eight international offices and facilities serving Asia, Japan, and the United States. The company's products include IC trays, carry tapes, and cover tapes. While it has a large stock of standard products, it also offers custom design, engineering, and production of custom products to meet client-specific requirements. Many of its clients are involved in semiconductor packaging and semiconductor manufacture.
Hwa Shu Enterprise Co. Ltd., founded in 1982 and headquartered in Kaohsiung City, Taiwan, is a manufacturer and distributor of IC and electronic component packaging. The company's product portfolio includes IC trays, carrier tapes, and chip trays. The company also designs and develops new molds to produce client-specific products and welcomes custom orders from private label and original equipment manufacturers. It serves industries that include semiconductor production and electronics manufacturing, among others.
Tomoe Engineering Co., Ltd., established in 1941 and located in Tokyo, Japan, is a manufacturer of decanter type centrifugal separators. The company offers a range of products, including gravity belt thickeners, HED-type dewatering centrifuges, disc-type centrifuges, rotary snails, and ASM tubular centrifuges, which cater to pharmaceuticals, food, chemistry, ships, electric power, and water treatment. The products are used in sludge dewatering, oil-water separation, clarification processes, liquid-liquid separation, and solids removal. The company’s expertise extends across diverse sectors, such as oil and gas and power generation.
Hiner-pack was founded in 2013 and is a high-tech manufacturing enterprise that integrates design, R&D, manufacturing, and sales of IC packaging, testing and semiconductive wafer fabrication process, based in China. The company is a pioneer of R&D and application in semiconductor carrier products. It specializes in development and provision of various semiconductor to carry and transport packaging products. It has mastered special processing technique and manufacturing in semiconductor packaging raw material field, used in automated handling, carrying, and transportation to provide customers turnkey services. Its advanced quality management system ensures that design specifications and customer requirements are met.
Ranking as of December 2024
Derivation Method| Rank | Company | Click Share |
|---|---|---|
| 1 | TopLine |
15.1%
|
| 2 | RH Murphy Company, Inc. |
13.5%
|
| 3 | Mishima Kosan Co.,Ltd. |
13.5%
|
| 4 | Akimoto Manufacturing Co., Ltd. |
10.4%
|
| 5 | Shinon Corporation |
9.1%
|
| 6 | Hiner-pack |
8.9%
|
| 7 | Hwa Shu Enterprise Co. Ltd. |
8.6%
|
| 8 | IwakiCo,. LTD |
8.6%
|
| 9 | TOMOE Engineering Co., Ltd. |
8.3%
|
| 10 | Kostat |
3.9%
|
Derivation Method
The ranking is calculated based on the click share within the ic tray page as of December 2024. Click share is defined as the total number of clicks for all companies during the period divided by the number of clicks for each company.Number of Employees
Newly Established Company
Company with a History
*Including some distributors, etc.
*Including some distributors, etc.
| Country | Number of Companies | Share (%) |
|---|---|---|
|
Japan
|
3 | 42.9% |
|
United States of America
|
2 | 28.6% |
|
Taiwan
|
1 | 14.3% |
|
China
|
1 | 14.3% |
