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11 products found
A.L.M.T. Corp.
150+ people viewing
Last viewed: 1 hour ago
■Product overview A silver and diamond heat dissipation board. It has a higher thermal conductivity of 600W/ (m･K) than Cu-Diamond, and can be appl...
A.L.M.T. Corp.
150+ people viewing
Last viewed: 6 hours ago
■Product overview A heat dissipating substrate with high electrical insulation and low dielectric constant, it is possible to form various metalliz...
A.L.M.T. Corp.
180+ people viewing
Last viewed: 11 hours ago
■Product overview A heat dissipation board that is easy to roll and press and has variable linear expansion coefficient and thermal conductivity. I...
A.L.M.T. Corp.
220+ people viewing
■Product overview CPC is a heat dissipation board with a laminated structure that has a Cu layer on the top and bottom of a Cu-Mo composite materia...
A.L.M.T. Corp.
90+ people viewing
■Product overview A binder-free single crystal diamond obtained using the CVD (Chemical Vapor Deposition) method. It is possible to form various me...
A.L.M.T. Corp.
120+ people viewing
■Product overview This is a copper and diamond heat dissipation board. It has a thermal expansion coefficient close to that of GaAs and GaN compoun...
A.L.M.T. Corp.
110+ people viewing
■Product overview The standard is a lightweight, low thermal expansion, high thermal conductivity heat dissipation board with a thermal expansion o...
A.L.M.T. Corp.
110+ people viewing
Last viewed: 4 hours ago
■Product overview It has an expansion coefficient similar to that of Si and has excellent mechanical strength, making it an ideal heat dissipation ...
A.L.M.T. Corp.
90+ people viewing
■Product overview A synthetic diamond single crystal with the highest thermal conductivity of any substance on earth. It is possible to form variou...
A.L.M.T. Corp.
180+ people viewing
Last viewed: 8 hours ago
■Product overview This is a heat dissipation board that combines the low thermal expansion of W and the high thermal conductivity of Cu, and the co...
A.L.M.T. Corp.
110+ people viewing
Last viewed: 4 hours ago
■Product overview It is a lightweight heat dissipation board that can be used in relatively complex shapes such as lid shapes, and has a specific g...
