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TPT Japan Co., Ltd.'s Wire Bonders

TPT Japan Co., Ltd.

5 products found

TPT Japan Co., Ltd.

Full manual wire Honda HB05

130+ people viewing

Last viewed: 11 hours ago

Response Rate
100.0 %
Response Time
39.6 hours

■Focus on price with minimum functions ・Ideal for prototype development as it can be used for both wedge bond and ball bond. ・Excellent cost perf...

TPT Japan Co., Ltd.

Manual wire bonder HB10

140+ people viewing

Last viewed: 2 hours ago

Response Rate
100.0 %
Response Time
39.6 hours

■Complete functions and stable bonding ・Ideal for prototype development as it can be used for both wedge bond and ball bond. ・Control the loop he...

TPT Japan Co., Ltd.

Semi-auto wire bonder HB16

150+ people viewing

Last viewed: 7 hours ago

Response Rate
100.0 %
Response Time
39.6 hours

■Pursuing high precision bonding and operability - Can be used for both wedge bond and ball bond, making it ideal for prototype development ・High ...

TPT Japan Co., Ltd.

Semi-auto wedge bonder for thick wire HB30

110+ people viewing

Last viewed: 7 hours ago

Response Rate
100.0 %
Response Time
39.6 hours

■Desktop wedge bonder for thick wires ・Compact and highly functional tabletop thick wire wedge bonder ・Loop shape control ・Easy operation with t...

TPT Japan Co., Ltd.

Tabletop Daihonda HB75

110+ people viewing

Last viewed: 11 hours ago

Response Rate
100.0 %
Response Time
39.6 hours

■High-precision pick and placer with a variety of functions HB75 has been remodeled from the wire bonder HB series as a pick and placer based on cu...


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