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Yamaha Robotics Holdings Co., Ltd.'s Wire Bonders

Yamaha Robotics Holdings Co., Ltd.

5 products found

Yamaha Robotics Holdings Co., Ltd.

High-speed bump bonder for wide areas for wafers SBB-5200

220+ people viewing

Last viewed: 6 hours ago

■Features ・By using wire bonder UTC-5000 as a base, high-speed bonding of 30ms/bump is achieved. ・Equipped with a wafer rotation stage, it is pos...

Yamaha Robotics Holdings Co., Ltd.

High-speed Cu wire bonder UTC-5000NeoCu Super

290+ people viewing

Last viewed: 13 hours ago

■Summary ・High-speed Cu wire bonder that is the culmination of the series ・Upgraded version of multi-wire compatible model that supports Cu wire,...

Yamaha Robotics Holdings Co., Ltd.

High-speed Au wire bonder UTC-5000Super

320+ people viewing

Last viewed: 10 hours ago

■Summary ・High-speed wire bonder that is the culmination of the series ・Upgraded version of basic model for gold wire bonding ・Improve device fu...

Yamaha Robotics Holdings Co., Ltd.

High-speed Cu wire bonder for wide frame UTC-5000WE NeoCu

220+ people viewing

■Summary ・High-speed Cu wire bonder that is the culmination of the series ・Upgraded version of wide frame compatible model compatible with 100mm ...

Yamaha Robotics Holdings Co., Ltd.

High-speed Au wire bonder for LED individual semiconductors UTC-5100

250+ people viewing

Last viewed: 11 hours ago

■Summary High-speed wire bonder compatible with wide frames and suitable for LED and discrete production. ■Features - Renewed X, Y, and Z motors f...


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