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9 products found
HiSOL,Inc.
180+ people viewing
Last viewed: 1 day ago
■Summary Model 7372E is a tabletop multi-die bonder equipped with two functions: a eutectic die bonder that mounts chips using a eutectic material ...
HiSOL,Inc.
160+ people viewing
Advances in new mounting technology require optimization of ball/stitch bonds in the wire bonding process. Among these, the capillaries we offer ar...
HiSOL,Inc.
220+ people viewing
Last viewed: 3 hours ago
■Summary Model 4546E is a semi-automatic multi-wedge wire bonder. The Y-axis and Z-axis are motor-controlled, allowing you to freely control the l...
HiSOL,Inc.
250+ people viewing
Last viewed: 5 hours ago
■Summary Model 4KE is a semi-automatic multi-wire bonder that can be used for both ball bonding and wedge bonding. The Y-axis and Z-axis are motor...
HiSOL,Inc.
250+ people viewing
■Summary Model 7476D (7600D specification) is a tabletop manual wedge wire bonder. Equipped with a new mechanism X-Y-Z 3-axis manipulator (patented...
HiSOL,Inc.
330+ people viewing
Last viewed: 6 hours ago
■Summary Model 7700D is a tabletop manual ball wire & bump bonder. Equipped with a new mechanism X-Y-Z 3-axis manipulator (patented) as standard, i...
HiSOL,Inc.
250+ people viewing
■Summary Model 7KE is a tabletop multi-wire bonder that can be used for both ball bonding and wedge bonding. Equipped with the latest vertical driv...
HiSOL,Inc.
220+ people viewing
■Summary The ultrasonic wedge wire bonder E series is a tabletop manual wedge wire bonder with a vertically driven X-Y-Z 3-axis manipulator (patent...
HiSOL,Inc.
190+ people viewing
Last viewed: 5 hours ago
A desktop wire bonder and die bonder ideal for failure analysis applications. Since it is operated using an X-Y-Z 3-axis manipulator (patented), it...
