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Japan Engis Co., Ltd.'s Bonding Wire

Japan Engis Co., Ltd.

1 product found

Wafer bonding equipment EBM-200HCD-Japan Engis Co., Ltd.

Japan Engis Co., Ltd.

Wafer bonding equipment EBM-200HCD

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EBM-250HCD is a device designed and developed for bonding wafers and bonding plates (ceramic plates). Solid wax is liquefied and a dispenser suppli...



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