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Hugle Electronics Co., Ltd.'s Bonding Wire

Hugle Electronics Co., Ltd.

1 product found

Perform eutectic, ultrasonic, epoxy, thermocompression, and solder flip bonding in one system Flip Chip Bonder Model 865-Hugle Electronics Co., Ltd.

Hugle Electronics Co., Ltd.

Perform eutectic, ultrasonic, epoxy, thermocompression, and solder flip bonding in one system Flip Chip Bonder Model 865

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The new Model 865 Flip Chip Bonder can perform eutectic, ultrasonic, epoxy, thermocompression, and solder flip bonding in one system. It has evolve...



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