All Categories
History
5 products found
Yamaha Robotics Holdings Co., Ltd.
2920+ people viewing
Last viewed: 15 hours ago
■Summary ・Package bonder compatible with Chip to Substrate's Thermal Compression Bonding (TCB) method ・Compatible with face down construction met...
Yamaha Robotics Holdings Co., Ltd.
2020+ people viewing
Last viewed: 12 hours ago
■Summary ・Package bonder compatible with Chip to Wafer's Thermal Compression Bonding (TCB) method ・Compatible with face down construction method ...
Yamaha Robotics Holdings Co., Ltd.
3300+ people viewing
Last viewed: 9 hours ago
■Summary High precision twin head die bonder. A highly productive, space-saving, high-precision die bonder equipped with dual bonding heads. The au...
Yamaha Robotics Holdings Co., Ltd.
780+ people viewing
■Summary ・High-speed, high-precision die bonder for small chips ・Compatible with eutectic, WBC/DAF, and epoxy processes ・This is a thermal eutec...
Yamaha Robotics Holdings Co., Ltd.
260+ people viewing
Last viewed: 2 hours ago
■Summary ・Achieved approximately 3 times the productivity and approximately 2 times the high precision mounting compared to conventional models. B...
