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5 products found
Yamaha Robotics Holdings Co., Ltd.
270+ people viewing
Last viewed: 1 hour ago
■Summary ・Package bonder compatible with Chip to Substrate's Thermal Compression Bonding (TCB) method ・Compatible with face down construction met...
Yamaha Robotics Holdings Co., Ltd.
320+ people viewing
Last viewed: 12 hours ago
■Summary ・Package bonder compatible with Chip to Wafer's Thermal Compression Bonding (TCB) method ・Compatible with face down construction method ...
Yamaha Robotics Holdings Co., Ltd.
270+ people viewing
Last viewed: 1 day ago
■Summary High precision twin head die bonder. A highly productive, space-saving, high-precision die bonder equipped with dual bonding heads. The au...
Yamaha Robotics Holdings Co., Ltd.
250+ people viewing
■Summary ・High-speed, high-precision die bonder for small chips ・Compatible with eutectic, WBC/DAF, and epoxy processes ・This is a thermal eutec...
Yamaha Robotics Holdings Co., Ltd.
180+ people viewing
Last viewed: 18 hours ago
■Summary ・Achieved approximately 3 times the productivity and approximately 2 times the high precision mounting compared to conventional models. B...
