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  1. Metoree
  2. Semiconductor Manufacturing
  3. Flip Chip Bonders
  4. HiSOL,Inc.

HiSOL,Inc.'s Flip Chip Bonders

HiSOL,Inc.

9 products found

Wafer bonding equipment WSB2 Wafer bonder 1WBS2 (4 inch type)-HiSOL,Inc.

HiSOL,Inc.

Wafer bonding equipment WSB2 Wafer bonder 1WBS2 (4 inch type)

90+ people viewing

Last viewed: 1 day ago

Standard Response

Response Rate
100.0 %
Response Time
27.0 hours

Wafer bonders from Logitech (UK), a company with over 50 years of experience in the polishing industry, solve your polishing problems. If the thic...


WSB2 Wafer bonding equipment WSB2 Wafer bonder 1WBS7 (6 inch type)-HiSOL,Inc.

HiSOL,Inc.

WSB2 Wafer bonding equipment WSB2 Wafer bonder 1WBS7 (6 inch type)

60+ people viewing

Last viewed: 6 hours ago

Standard Response

Response Rate
100.0 %
Response Time
27.0 hours

Wafer bonders from Logitech (UK), a company with over 50 years of experience in the polishing industry, solve your polishing problems. If the thic...


Die Bonder Epoxy Die Bonder Model 7200CR-HiSOL,Inc.

HiSOL,Inc.

Die Bonder Epoxy Die Bonder Model 7200CR

120+ people viewing

Last viewed: 1 day ago

Standard Response

Response Rate
100.0 %
Response Time
27.0 hours

■Summary Model 7200CR is a tabletop manual die bonder. Equipped with a new X-Y-Z 3-axis manipulator (patented) as standard for outstanding operabil...


Die bonder tabletop manual eutectic die bonder (6 types collet type) model 7327C-HiSOL,Inc.

HiSOL,Inc.

Die bonder tabletop manual eutectic die bonder (6 types collet type) model 7327C

120+ people viewing

Last viewed: 6 hours ago

Standard Response

Response Rate
100.0 %
Response Time
27.0 hours

■Summary Model 7327C manufactured by West Bond is a tabletop manual eutectic die bonder that places a eutectic material (AuSn, etc.) on a substrate...


Die Bonder Manual Epoxy Eutectic Die Bonder Model 7372E-HiSOL,Inc.

HiSOL,Inc.

Die Bonder Manual Epoxy Eutectic Die Bonder Model 7372E

150+ people viewing

Last viewed: 9 hours ago

Standard Response

Response Rate
100.0 %
Response Time
27.0 hours

■Summary Model 7372E is a tabletop multi-die bonder equipped with two functions: a eutectic die bonder that mounts chips using a eutectic material ...


Ultra-high precision mounting machine flip chip bonder M1300-HiSOL,Inc.

HiSOL,Inc.

Ultra-high precision mounting machine flip chip bonder M1300

180+ people viewing

Standard Response

Response Rate
100.0 %
Response Time
27.0 hours

■Summary ・Ideal for ultra-high precision mounting applications such as laser-related and opto device mounting. ・High reproducibility of load, dis...


Auto flip chip bonder MODEL-400-HiSOL,Inc.

HiSOL,Inc.

Auto flip chip bonder MODEL-400

240+ people viewing

Last viewed: 1 day ago

Standard Response

Response Rate
100.0 %
Response Time
27.0 hours

2-8 A wide range of handling/mounting is possible by replacing adapters, regardless of the target object, such as 2-8 wafers, waffle trays, adhesiv...

2 models listed

M400TR-Auto flip chip bonder MODEL-400
M400α-Auto flip chip bonder MODEL-400

Tabletop flip chip bonder M90 for research and development-HiSOL,Inc.

HiSOL,Inc.

Tabletop flip chip bonder M90 for research and development

250+ people viewing

Last viewed: 48 minutes ago

Standard Response

Response Rate
100.0 %
Response Time
27.0 hours

The PC software operation system allows for easy and highly reproducible implementation. Ideal for optical component mounting, MEMS device assembly...

2 models listed

M90-Tabletop flip chip bonder M90 for research and development
M95-Tabletop flip chip bonder M90 for research and development

Tabletop manual ball wire & bump bonder MODEL-7700D-HiSOL,Inc.

HiSOL,Inc.

Tabletop manual ball wire & bump bonder MODEL-7700D

290+ people viewing

Last viewed: 10 hours ago

Standard Response

Response Rate
100.0 %
Response Time
27.0 hours

■Summary Model 7700D is a tabletop manual ball wire & bump bonder. Equipped with a new mechanism X-Y-Z 3-axis manipulator (patented) as standard, i...



Check the product list of HiSOL,Inc.

Related Categories for Flip Chip Bonders

Semiconductor Lithography Equipment Semiconductor Manufacturing Equipment Component & Part Machining Lithographers Chemical Vapor Deposition (CVD) Systems Chemical Mechanical Polishing (CMP) Machines ALD Systems Reflow Machines Resist Coaters Electron Beam Lithography Systems Ion Implanters PVDF Bernoulli Chucks Wire Bonders Bonding Wire Silicon Wafers Microelectronics & Semiconductor Packages

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