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9 products found
HiSOL,Inc.
130+ people viewing
Last viewed: 11 hours ago
Wafer bonders from Logitech (UK), a company with over 50 years of experience in the polishing industry, solve your polishing problems. If the thic...
HiSOL,Inc.
100+ people viewing
Last viewed: 3 hours ago
Wafer bonders from Logitech (UK), a company with over 50 years of experience in the polishing industry, solve your polishing problems. If the thic...
HiSOL,Inc.
170+ people viewing
Last viewed: 3 hours ago
■Summary Model 7200CR is a tabletop manual die bonder. Equipped with a new X-Y-Z 3-axis manipulator (patented) as standard for outstanding operabil...
HiSOL,Inc.
160+ people viewing
Last viewed: 1 day ago
■Summary Model 7327C manufactured by West Bond is a tabletop manual eutectic die bonder that places a eutectic material (AuSn, etc.) on a substrate...
HiSOL,Inc.
190+ people viewing
■Summary Model 7372E is a tabletop multi-die bonder equipped with two functions: a eutectic die bonder that mounts chips using a eutectic material ...
HiSOL,Inc.
220+ people viewing
Last viewed: 17 hours ago
■Summary ・Ideal for ultra-high precision mounting applications such as laser-related and opto device mounting. ・High reproducibility of load, dis...
HiSOL,Inc.
300+ people viewing
Last viewed: 1 day ago
2-8 A wide range of handling/mounting is possible by replacing adapters, regardless of the target object, such as 2-8 wafers, waffle trays, adhesiv...
2 models listed
HiSOL,Inc.
320+ people viewing
Last viewed: 8 hours ago
The PC software operation system allows for easy and highly reproducible implementation. Ideal for optical component mounting, MEMS device assembly...
2 models listed
HiSOL,Inc.
340+ people viewing
Last viewed: 19 hours ago
■Summary Model 7700D is a tabletop manual ball wire & bump bonder. Equipped with a new mechanism X-Y-Z 3-axis manipulator (patented) as standard, i...
