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PFA Co., Ltd.'s Flip Chip Bonders

PFA Co., Ltd.

1 product found

PFA Co., Ltd.

Flip chip bonder for small devices AFM-15

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Response Rate
100.0 %
Response Time
92.9 hours

■Summary This is a device that performs FC bonding using US bonding (ultrasonic waves) for small electronic devices. ■Features By increasing ultra...

3 models listed

AFM-15 1505-Flip chip bonder for small devices AFM-15
AFM-15 1508-Flip chip bonder for small devices AFM-15
AFM-15 1562-Flip chip bonder for small devices AFM-15

Check the product list of PFA Co., Ltd.

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