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Hugle Electronics Co., Ltd.'s Flip Chip Bonders

Hugle Electronics Co., Ltd.

2 products found

Hugle Electronics Co., Ltd.

Manual flip chip placement system Model 850 with excellent ease of use and positioning accuracy

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Last viewed: 14 hours ago

A manual flip chip placement system with excellent ease of use and positioning accuracy. ■Product overview ・Manual X-Y sliding table ・Micrometer...

Hugle Electronics Co., Ltd.

Perform eutectic, ultrasonic, epoxy, thermocompression, and solder flip bonding in one system Flip Chip Bonder Model 865

150+ people viewing

Last viewed: 21 hours ago

The new Model 865 Flip Chip Bonder can perform eutectic, ultrasonic, epoxy, thermocompression, and solder flip bonding in one system. It has evolve...


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