Kosaka Laboratory Ltd.'s Flip Chip Bonders

Kosaka Laboratory Ltd.

4 products found

Kosaka Laboratory Ltd.

Die bonder TR-100 series

120+ people viewing

Last viewed: 48 seconds ago

Response Rate
100.0 %

Response Time
35.5 hours

■Features The TR-100 series achieves high precision and high speed. We can respond flexibly by combining units such as development, prototyping, an...

Kosaka Laboratory Ltd.

Die bonder LD manufacturing equipment KFA-11

140+ people viewing

Last viewed: 37 seconds ago

Response Rate
100.0 %

Response Time
35.5 hours

■Features This is LD manufacturing equipment that can be used for both LD chips and PD chips. Application: LD manufacturing

Kosaka Laboratory Ltd.

Die bonder LD manufacturing equipment PD die bonder

120+ people viewing

Last viewed: 20 seconds ago

Response Rate
100.0 %

Response Time
35.5 hours

■Features High precision type die bonder for PD chip mounting. Application: LD manufacturing

Kosaka Laboratory Ltd.

Die bonder resin coating equipment

110+ people viewing

Last viewed: 10 seconds ago

Response Rate
100.0 %

Response Time
35.5 hours

■Features Resin coating equipment is a device that injects a certain amount of resin into packages such as LED substrates using a dispenser. The tr...

Check the product list of Kosaka Laboratory Ltd.

Kosaka Laboratory Ltd.'s Flip Chip Bonders

Die bonder TR-100 series

Die bonder LD manufacturing equipment KFA-11

Die bonder LD manufacturing equipment PD die bonder

Die bonder resin coating equipment

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