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  1. Metoree
  2. Semiconductor Manufacturing
  3. Flip Chip Bonders
  4. AKIM Co., Ltd.

AKIM Co., Ltd.'s Flip Chip Bonders

AKIM Co., Ltd.

5 products found

Semiconductor related equipment Chip mounter (transfer type) ACMT860-AKIM Co., Ltd.

AKIM Co., Ltd.

Semiconductor related equipment Chip mounter (transfer type) ACMT860

840+ people viewing

Last viewed: 5 hours ago

Response Rate
100.0 %
Response Time
38.5 hours

■Summary This is a device that performs die bonding of IC chips at high speed using turret transport. ■Features ・Chip is adhesively mounted on th...


Semiconductor related equipment die picker ADIP860-AKIM Co., Ltd.

AKIM Co., Ltd.

Semiconductor related equipment die picker ADIP860

140+ people viewing

Last viewed: 5 hours ago

Response Rate
100.0 %
Response Time
38.5 hours

■Summary This is a device that loads IC chips picked up from a wafer into a tray. ■Features - Compatible with wafer rings up to 12 inches. ・Remov...


Temperature slope inspection device flip chip mounter AFCM860-AKIM Co., Ltd.

AKIM Co., Ltd.

Temperature slope inspection device flip chip mounter AFCM860

160+ people viewing

Last viewed: 5 hours ago

Response Rate
100.0 %
Response Time
38.5 hours

■Summary This is a device that picks up IC chips from a wafer and mounts them on a TCXO package. ■Features ・The turret table provides low vibrati...


Temperature slope inspection device Chip die bonder ASCD750-AKIM Co., Ltd.

AKIM Co., Ltd.

Temperature slope inspection device Chip die bonder ASCD750

120+ people viewing

Last viewed: 5 hours ago

Response Rate
100.0 %
Response Time
38.5 hours

■Summary This is a device that applies adhesive to the sensor package and mounts the sensor chip with high precision. ■Features ・The turret table...


Temperature slope inspection device Chip die bonder (high speed type) ASCD860T (tray type)-AKIM Co., Ltd.

AKIM Co., Ltd.

Temperature slope inspection device Chip die bonder (high speed type) ASCD860T (tray type)

110+ people viewing

Last viewed: 5 hours ago

Response Rate
100.0 %
Response Time
38.5 hours

■Summary This is a device that applies adhesive to the sensor package and mounts the sensor chip with high precision. ■Features ・Turret table pro...



Check the product list of AKIM Co., Ltd.

Related Categories for Flip Chip Bonders

Semiconductor Lithography Equipment Semiconductor Manufacturing Equipment Component & Part Machining Lithographers Chemical Vapor Deposition (CVD) Systems Chemical Mechanical Polishing (CMP) Machines ALD Systems Reflow Machines Resist Coaters Electron Beam Lithography Systems Ion Implanters PVDF Bernoulli Chucks Wire Bonders Bonding Wire Silicon Wafers Microelectronics & Semiconductor Packages

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