15 Flip Chip Bonder Manufacturers in 2024
This section provides an overview for flip chip bonders as well as their applications and principles. Also, please take a look at the list of 15 flip chip bonder manufacturers and their company rankings. Here are the top-ranked flip chip bonder companies as of November, 2024: 1.Yamaha Motor Corporation, USA, 2.Semiconductor Equipment Corporation, 3.SET Corporation SA.
Table of Contents
What Is a Flip Chip Bonder?
A flip chip bonder is a device used to mount various semiconductor devices on a substrate and is a new mounting technology that replaces conventional wire bonding. The term "flip chip bonder" is derived from the fact that semiconductor devices formed on a wafer are cut out (bare chip) and then flipped (flip) for bonding.
Almost all bare chip mounting has been replaced by flip chip bonding, which offers many advantages, and wire bonding continues to decline.
Uses of Flip Chip Bonders
Flip chip bonders are devices that bond and mount semiconductor devices onto substrates. While conventional wire bonding allows I/Os, the entry and exit points for signals, to be placed only on the periphery of the device, the flip chip method allows the entire underside of the device to be replaced with I/Os. This makes it possible to provide many I/Os, even with small appliances.
In addition, in the case of LEDs, where heat generation is a significant problem, the heat generated by the element can be dissipated directly to the substrate because it is mounted directly on the substrate without wires.
Principle of Flip Chip Bonders
Elements are cut from a wafer on which semiconductor elements are formed and then arranged on a flip chip bonder's sorter (arranger), which inverts the elements. The inverted elements are then removed by a crimping device called a head and placed on the substrate with high precision by image processing.
In the ultrasonic method, which is currently widely used, ultrasonic waves are transmitted through the head to the protruding terminals called bumps on the backside (substrate side) of the element, which are instantaneously melted into the wiring pattern to achieve electrical continuity.
Sometimes, the space between the substrate and the device is filled with underfill resin. In such cases, the element and substrate are bonded using conductive adhesive instead of ultrasonic bonding.
Flip chip bonding and conventional wire bonding have the following advantages.
- High throughput because wires can be bonded in batches instead of connecting I/Os one at a time.
- High integration is possible because there is no chip-on-chip bonding, and no wire space is required around the chip's perimeter.
- Suitable for high-speed signal processing due to low attenuation of high-frequency signals and signal loss caused by wires.
List of 15 Flip Chip Bonder Manufacturers
*Including some distributors, etc.
Sort by Features
- Default
- Company Size: largest first
- Year Founded: oldest first
- Year Founded: earliest first
Sort by Area
- United States of America
- France
- Germany
- Japan
- Republic of Korea
- Singapore
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Yamaha Motor Corporation, USA
Surface Mount Technology | Flip Chip Bonder
Manufacturer Overview
Yamaha Motor Corporation, founded in 1955 with their Head Quarters in Iwata, Japan is a manufacturer of motorcycles, marine products, and other motorized products. Yamaha Motor Robotics, founded in 1955 is a subdivision of Yamaha Motor Corporation, and they produce machines that are used in the surface mounter industry. The company offers servo-motor control and image recognition technology for vision systems to develop solder-paste printers, printed circuit board inspection machines, flip-chip hybrid placers, and dispensers. They also provide SMD storage systems and software solutions, and they produce articulated robots, and cartesian robots that have applications in robotics.
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Semiconductor Equipment Corporation
Flip Chip Bonder
Company Overview
Semiconductor Equipment Corporation, founded in 1975, is a manufacturer and distributor of equipment and solutions for the semiconductor industries, headquartered in California, USA. The company primarily manufactures equipment and processes crucial for producing integrated circuits and electronic devices. Its range of equipment and solutions includes deposition equipment, etching equipment, process tools, and custom solutions. Semiconductor fabrication facilities worldwide use these products and equipment to produce microchips and electronic components used in multiple electronic devices.
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TDK Corporation.
Flip Chip Bonding System
Manufacturer Overview
TDK Corporation, established in 1935, is a manufacturer of electronic solutions for the smart society based in Tokyo, Japan. The company is a part of the TDK Group, which has over 250 locations in more than 30 countries worldwide and employs over 103,000 people. They offer a wide range of products, including sensors, power supplies, and magnetic application products. The robotics industry is evolving at a rapid pace, and they are now offering , a robot development platform equipped with a variety of sensors essential to the accurate operation of robots, enabling more efficiency across a wide range of robot development.
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SHIBUYA CORPORATION
FDB250 Flip Chip Bonder / High-Accuracy Die Bonder
Manufacturer Overview
Shibuya Corporation, founded in 1931, is a Japan-based manufacturer and retailer of industrial systems and equipment. Their product portfolio is available in various categories, including packaging plant business, mechatronics, agricultural and regenerative medicine. The packaging plant segment includes various equipment and systems used in the bottling, packaging, food processing and pharmaceutical industries. The agricultural division includes grading & analyzing systems such as fruit, welsh onion, and flowering plant grading systems. The mechatronics system segment includes medical equipment such as dialysis systems, medical lasers, and UV Light treatment systems. The division also includes semiconductor manufacturing and cutting processing systems.
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ASMPT AMICRA GmbH
AFC Plus - Die Bonder and Flip Chip Bonder
Manufacturer Overview
ASMPT AMICRA GmbH is a German ISO 9001:2015 certified manufacturer of semiconductor assembly and packaging products that was established in Regensburg, Bavaria in 2001. The company various branded products including flip chip bonders for advanced packaging applications (e.g. TCB), die bonders for chip-on-submount, high throughput, and submicron placement accuracy applications. These are used for laser diodes, silicon photonics, automotive sensors, and MEMS. ASMPT AMICRA products are used mainly by clients in optical communication and computing, semiconductors, information technology, and medical device manufacturing.
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SHIBAURA MECHATRONICS CORPORATION
Flip Chip Bonder
Manufacturer Overview
Shibaura Mechatronics Corporation, established in 1939 and headquartered in Yokohama, Japan, is a manufacturer and supplier of various production equipment. Its product line encompasses FPD manufacturing equipments that include array process, cell process, and module process equipment. ALso offered are semiconductor manufacturing equipment, vacuum equipment, and other equipment used in applications related to manufacturing equipment. The company also develops and manufactures vending machines compatible with numerous electronic payment systems, including credit cards and electronic money.
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Athlete FA Corporation
Flip Chip Bonder
Manufacturer Overview
Athlete FA Corporation, founded in 1988 and based in Nagano, Japan, is a manufacturer, designer, and seller of automation equipment. The company offers a wide range of products including Micro ball mounter used in digital devices like smartphones and tablets, flip chip bonders for packaging a broad range of electronics that include Integrated circuits and infrared sensors,, customized machines like aluminum attachment machines, and LCD systems among others. It holds the ISO 9001 and ISO 14001 certifications.
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Toray Engineering Co., Ltd.
Flip Chip Bonder for Chip on Wafer (COW)
Manufacturer Overview
Toray Engineering Co., Ltd., a company founded in the year 1960, based in Tokyo, Japan is a manufacturer and supplier of engineering equipment. The product portfolio includes plant engineering, factory automation, semiconductor-production equipment, FFD- production equipment, film-production equipment, battery production equipment, software, and measuring equipment. The company also provides effective solutions with the latest innovations which include green innovation, life innovation, AI technology, and laser transfer technology. The products are used in multiple industries which include pharmaceutical, fine chemical, film, plant maintenance, and core technologies.
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SEC Engineering
Flip Chip Bonder
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Flip Chip Bonder Manufacturer Ranking
*Including some distributors, etc.Ranking as of November 2024
Derivation Method| Rank | Company | Click Share |
|---|---|---|
| 1 | Yamaha Motor Corporation, USA |
12.0%
|
| 2 | Semiconductor Equipment Corporation |
11.0%
|
| 3 | SET Corporation SA |
7.8%
|
| 4 | SHIBUYA CORPORATION |
7.8%
|
| 5 | Advanced Techniques US Inc. |
7.5%
|
| 6 | TDK Corporation. |
6.7%
|
| 7 | Chip Hua Equipment & Tools Pte Ltd |
6.4%
|
| 8 | SEC Engineering |
5.9%
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| 9 | SHIBAURA MECHATRONICS CORPORATION |
5.6%
|
| 10 | Adwells Co., Ltd. |
5.3%
|
Derivation Method
The ranking is calculated based on the click share within the flip chip bonder page as of November 2024. Click share is defined as the total number of clicks for all companies during the period divided by the number of clicks for each company.Number of Employees
- TDK Corporation.: 116,808
- SHIBUYA CORPORATION: 3,635
- SHIBAURA MECHATRONICS CORPORATION: 1,221
Newly Established Company
- Yamaha Motor Corporation, USA: 2011 (13 years ago)
- Adwells Co., Ltd.: 2007 (17 years ago)
- Athlete FA Corporation: 1988 (36 years ago)
Company with a History
- SHIBUYA CORPORATION: 1931 (93 years ago)
- TDK Corporation.: 1935 (89 years ago)
- Toray Engineering Co., Ltd.: 1960 (64 years ago)
Flip Chip Bonder Manufacturers in United States
*Including some distributors, etc.
- Yamaha Motor Corporation, USA
- Semiconductor Equipment Corporation
- Advanced Techniques US Inc.
- Setna, LLC
Global Distribution of Flip Chip Bonder Manufacturers by Country
*Including some distributors, etc.
| Country | Number of Companies | Share (%) |
|---|---|---|
Japan
|
5 | 38.5% |
United States of America
|
4 | 30.8% |
Germany
|
1 | 7.7% |
Singapore
|
1 | 7.7% |
Republic of Korea
|
1 | 7.7% |
France
|
1 | 7.7% |
List of Flip Chip Bonder Products
1 product is listed.
Adwells Co., Ltd.
Ultrasonic high accuracy flip chip bonder (US Precision Flip Chip Bonder)
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High accuracy implementation with ultrasonic processes ・ High accuracy implementation with ultrasonic process ・ High -precision positioning func...
