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This section provides an overview for flip chip bonders as well as their applications and principles. Also, please take a look at the list of 15 flip chip bonder manufacturers and their company rankings. Here are the top-ranked flip chip bonder companies as of January, 2025: 1.Yamaha Motor Corporation, USA, 2.Semiconductor Equipment Corporation, 3.Advanced Techniques US Inc..
Table of Contents
A flip chip bonder is a device used to mount various semiconductor devices on a substrate and is a new mounting technology that replaces conventional wire bonding. The term "flip chip bonder" is derived from the fact that semiconductor devices formed on a wafer are cut out (bare chip) and then flipped (flip) for bonding.
Almost all bare chip mounting has been replaced by flip chip bonding, which offers many advantages, and wire bonding continues to decline.
Flip chip bonders are devices that bond and mount semiconductor devices onto substrates. While conventional wire bonding allows I/Os, the entry and exit points for signals, to be placed only on the periphery of the device, the flip chip method allows the entire underside of the device to be replaced with I/Os. This makes it possible to provide many I/Os, even with small appliances.
In addition, in the case of LEDs, where heat generation is a significant problem, the heat generated by the element can be dissipated directly to the substrate because it is mounted directly on the substrate without wires.
Elements are cut from a wafer on which semiconductor elements are formed and then arranged on a flip chip bonder's sorter (arranger), which inverts the elements. The inverted elements are then removed by a crimping device called a head and placed on the substrate with high precision by image processing.
In the ultrasonic method, which is currently widely used, ultrasonic waves are transmitted through the head to the protruding terminals called bumps on the backside (substrate side) of the element, which are instantaneously melted into the wiring pattern to achieve electrical continuity.
Sometimes, the space between the substrate and the device is filled with underfill resin. In such cases, the element and substrate are bonded using conductive adhesive instead of ultrasonic bonding.
Flip chip bonding and conventional wire bonding have the following advantages.
*Including some distributors, etc.
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Yamaha Motor Corporation, founded in 1955 with their Head Quarters in Iwata, Japan is a manufacturer of motorcycles, marine products, and other motorized products. Yamaha Motor Robotics, founded in 1955 is a subdivision of Yamaha Motor Corporation, and they produce machines that are used in the surface mounter industry. The company offers servo-motor control and image recognition technology for vision systems to develop solder-paste printers, printed circuit board inspection machines, flip-chip hybrid placers, and dispensers. They also provide SMD storage systems and software solutions, and they produce articulated robots, and cartesian robots that have applications in robotics.
Semiconductor Equipment Corporation, founded in 1975, is a manufacturer and distributor of equipment and solutions for the semiconductor industries, headquartered in California, USA. The company primarily manufactures equipment and processes crucial for producing integrated circuits and electronic devices. Its range of equipment and solutions includes deposition equipment, etching equipment, process tools, and custom solutions. Semiconductor fabrication facilities worldwide use these products and equipment to produce microchips and electronic components used in multiple electronic devices.
TDK Corporation, established in 1935, is a manufacturer of electronic solutions for the smart society based in Tokyo, Japan. The company is a part of the TDK Group, which has over 250 locations in more than 30 countries worldwide and employs over 103,000 people. They offer a wide range of products, including sensors, power supplies, and magnetic application products. The robotics industry is evolving at a rapid pace, and they are now offering , a robot development platform equipped with a variety of sensors essential to the accurate operation of robots, enabling more efficiency across a wide range of robot development.
Shibuya Corporation, founded in 1931, is a Japan-based manufacturer and retailer of industrial systems and equipment. Their product portfolio is available in various categories, including packaging plant business, mechatronics, agricultural and regenerative medicine. The packaging plant segment includes various equipment and systems used in the bottling, packaging, food processing and pharmaceutical industries. The agricultural division includes grading & analyzing systems such as fruit, welsh onion, and flowering plant grading systems. The mechatronics system segment includes medical equipment such as dialysis systems, medical lasers, and UV Light treatment systems. The division also includes semiconductor manufacturing and cutting processing systems.
ASMPT AMICRA GmbH is a German ISO 9001:2015 certified manufacturer of semiconductor assembly and packaging products that was established in Regensburg, Bavaria in 2001. The company various branded products including flip chip bonders for advanced packaging applications (e.g. TCB), die bonders for chip-on-submount, high throughput, and submicron placement accuracy applications. These are used for laser diodes, silicon photonics, automotive sensors, and MEMS. ASMPT AMICRA products are used mainly by clients in optical communication and computing, semiconductors, information technology, and medical device manufacturing.
Shibaura Mechatronics Corporation, established in 1939 and headquartered in Yokohama, Japan, is a manufacturer and supplier of various production equipment. Its product line encompasses FPD manufacturing equipments that include array process, cell process, and module process equipment. ALso offered are semiconductor manufacturing equipment, vacuum equipment, and other equipment used in applications related to manufacturing equipment. The company also develops and manufactures vending machines compatible with numerous electronic payment systems, including credit cards and electronic money.
Athlete FA Corporation, founded in 1988 and based in Nagano, Japan, is a manufacturer, designer, and seller of automation equipment. The company offers a wide range of products including Micro ball mounter used in digital devices like smartphones and tablets, flip chip bonders for packaging a broad range of electronics that include Integrated circuits and infrared sensors,, customized machines like aluminum attachment machines, and LCD systems among others. It holds the ISO 9001 and ISO 14001 certifications.
Toray Engineering Co., Ltd., a company founded in the year 1960, based in Tokyo, Japan is a manufacturer and supplier of engineering equipment. The product portfolio includes plant engineering, factory automation, semiconductor-production equipment, FFD- production equipment, film-production equipment, battery production equipment, software, and measuring equipment. The company also provides effective solutions with the latest innovations which include green innovation, life innovation, AI technology, and laser transfer technology. The products are used in multiple industries which include pharmaceutical, fine chemical, film, plant maintenance, and core technologies.
Ranking as of January 2025
Derivation Method| Rank | Company | Click Share |
|---|---|---|
| 1 | Yamaha Motor Corporation, USA |
12.0%
|
| 2 | Semiconductor Equipment Corporation |
11.2%
|
| 3 | Advanced Techniques US Inc. |
7.9%
|
| 4 | SET Corporation SA |
7.6%
|
| 5 | SHIBUYA CORPORATION |
7.6%
|
| 6 | TDK Corporation. |
6.9%
|
| 7 | Chip Hua Equipment & Tools Pte Ltd |
6.6%
|
| 8 | SEC Engineering |
5.6%
|
| 9 | SHIBAURA MECHATRONICS CORPORATION |
5.6%
|
| 10 | ASMPT AMICRA GmbH |
5.1%
|
Derivation Method
The ranking is calculated based on the click share within the flip chip bonder page as of January 2025. Click share is defined as the total number of clicks for all companies during the period divided by the number of clicks for each company.Number of Employees
Newly Established Company
Company with a History
*Including some distributors, etc.
*Including some distributors, etc.
| Country | Number of Companies | Share (%) |
|---|---|---|
|
Japan
|
5 | 38.5% |
|
United States of America
|
4 | 30.8% |
|
Germany
|
1 | 7.7% |
Singapore
|
1 | 7.7% |
Republic of Korea
|
1 | 7.7% |
France
|
1 | 7.7% |
20 products found
20 products
Yamaha Robotics Holdings Co., Ltd.
70+ people viewing
Last viewed: 53 minutes ago
■Summary ・Achieved approximately 3 times the productivity and approximately 2 times the high precision mounting compared to conventional models. B...
PFA Co., Ltd.
240+ people viewing
Last viewed: 5 hours ago
■Summary This is a device that performs FC bonding using US bonding (ultrasonic waves) for small electronic devices. ■Features By increasing ultra...
3 models listed
Hugle Electronics Co., Ltd.
40+ people viewing
A manual flip chip placement system with excellent ease of use and positioning accuracy. ■Product overview ・Manual X-Y sliding table ・Micrometer...
Hugle Electronics Co., Ltd.
50+ people viewing
The new Model 865 Flip Chip Bonder can perform eutectic, ultrasonic, epoxy, thermocompression, and solder flip bonding in one system. It has evolve...
HiSOL,Inc.
190+ people viewing
Last viewed: 15 hours ago
Standard Response
■Summary Model 7700D is a tabletop manual ball wire & bump bonder. Equipped with a new mechanism X-Y-Z 3-axis manipulator (patented) as standard, i...
HiSOL,Inc.
100+ people viewing
Last viewed: 1 day ago
Standard Response
■Summary ・Ideal for ultra-high precision mounting applications such as laser-related and opto device mounting. ・High reproducibility of load, dis...
HiSOL,Inc.
150+ people viewing
Standard Response
2-8 A wide range of handling/mounting is possible by replacing adapters, regardless of the target object, such as 2-8 wafers, waffle trays, adhesiv...
2 models listed
HiSOL,Inc.
160+ people viewing
Last viewed: 1 day ago
Standard Response
The PC software operation system allows for easy and highly reproducible implementation. Ideal for optical component mounting, MEMS device assembly...
2 models listed
Yamaha Robotics Holdings Co., Ltd.
80+ people viewing
Last viewed: 5 hours ago
■Summary ・Package bonder compatible with Chip to Wafer's Thermal Compression Bonding (TCB) method ・Compatible with face down construction method ...
Kosaka Laboratory Ltd.
70+ people viewing
Last viewed: 19 hours ago
■Features The TR-100 series achieves high precision and high speed. We can respond flexibly by combining units such as development, prototyping, an...
Kosaka Laboratory Ltd.
80+ people viewing
Last viewed: 15 hours ago
■Features This is LD manufacturing equipment that can be used for both LD chips and PD chips. Application: LD manufacturing
Kosaka Laboratory Ltd.
60+ people viewing
Last viewed: 1 day ago
■Features High precision type die bonder for PD chip mounting. Application: LD manufacturing
Kosaka Laboratory Ltd.
60+ people viewing
Last viewed: 10 hours ago
■Features Resin coating equipment is a device that injects a certain amount of resin into packages such as LED substrates using a dispenser. The tr...
AKIM Co., Ltd.
80+ people viewing
Last viewed: 10 hours ago
■Summary This is a device that picks up IC chips from a wafer and mounts them on a TCXO package. ■Features ・The turret table provides low vibrati...
AKIM Co., Ltd.
70+ people viewing
Last viewed: 10 hours ago
■Summary This is a device that loads IC chips picked up from a wafer into a tray. ■Features - Compatible with wafer rings up to 12 inches. ・Remov...
AKIM Co., Ltd.
70+ people viewing
Last viewed: 8 hours ago
■Summary This is a device that performs die bonding of IC chips at high speed using turret transport. ■Features ・Chip is adhesively mounted on th...
