Semiconductor manufacturing equipment Lamination/Peeling equipment TWS series Coating and laminating equipment
TAZMO CO.,LTD.
About This Product
We support ultra-thin wafers for the purpose of advanced 3D packaging and countermeasures against vulnerabilities caused by device thinning, and further miniaturize and save semiconductor packaging.
Developed/designed to advance energy. We use our coating technology to apply a uniform film thickness, and after laminating it to the support, we cure it with ultraviolet light.
■Product features
·platform
Utilizing Tatsumo's many years of coater development technology, we have developed the optimal equipment specifically for UV-curable materials. Everything from coating to lamination is done automatically.
・Process unit
Achieves throughput of over 25WPH
Achieves TTV (difference between maximum and minimum thickness in wafer flatness application area) of less than 3um
Due to room temperature bonding (using UV curing resin), there is almost no thermal shock when bonding to the support substrate.
The supporting board can be used repeatedly, contributing to cost reduction.
We also have glass recycling equipment available.
Dry process. Bonding and peeling are done using a completely dry process.
・Easy to operate
Achieves excellent operability with GUI screen. You can easily edit complex recipes.
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Product
Semiconductor manufacturing equipment Lamination/Peeling equipment TWS series Coating and laminating equipment
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Handling Company
TAZMO CO.,LTD.
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Categories
1 Models of Semiconductor manufacturing equipment Lamination/Peeling equipment TWS series Coating and laminating equipment
| Product Image | Part Number | Price (excluding tax) | Cassette format | Others | Pasting mechanism | Processing work | Spin cup | Support substrate |
|---|---|---|---|---|---|---|---|---|
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TWS series coating and laminating equipment |
Available upon quote |
2000 series normal open or double pitch cassette 3000 Series FOUP/FOSB |
Safety specification standard | Mounted |
2000 series Φ150~200mm wafer (+1.0) 3000 series Φ200~300mm wafer (+1.0) |
Equipped with (no use of organic solvents) | GLASS. We recommend a large diameter one of 0.5 to 1.0 mm for processing workpieces. |
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About Company Handling This Product
- Japan