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  4. Semiconductor manufacturing equipment Lamination/Peeling equipment TWS series Coating and laminating equipment (TAZMO CO.,LTD.)
Semiconductor manufacturing equipment Lamination/Peeling equipment TWS series Coating and laminating equipment-TWS series coating and laminating equipment
Semiconductor manufacturing equipment Lamination/Peeling equipment TWS series Coating and laminating equipment-TAZMO CO.,LTD.

Semiconductor manufacturing equipment Lamination/Peeling equipment TWS series Coating and laminating equipment
TAZMO CO.,LTD.

About This Product

We support ultra-thin wafers for the purpose of advanced 3D packaging and countermeasures against vulnerabilities caused by device thinning, and further miniaturize and save semiconductor packaging. Developed/designed to advance energy. We use our coating technology to apply a uniform film thickness, and after laminating it to the support, we cure it with ultraviolet light.

■Product features

·platform Utilizing Tatsumo's many years of coater development technology, we have developed the optimal equipment specifically for UV-curable materials. Everything from coating to lamination is done automatically. ・Process unit Achieves throughput of over 25WPH Achieves TTV (difference between maximum and minimum thickness in wafer flatness application area) of less than 3um Due to room temperature bonding (using UV curing resin), there is almost no thermal shock when bonding to the support substrate. The supporting board can be used repeatedly, contributing to cost reduction. We also have glass recycling equipment available. Dry process. Bonding and peeling are done using a completely dry process. ・Easy to operate Achieves excellent operability with GUI screen. You can easily edit complex recipes.

  • Product

    Semiconductor manufacturing equipment Lamination/Peeling equipment TWS series Coating and laminating equipment

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1 Models of Semiconductor manufacturing equipment Lamination/Peeling equipment TWS series Coating and laminating equipment

Image Part Number Price (excluding tax) Pasting mechanism Support substrate Processing work Spin cup Cassette format Others
Semiconductor manufacturing equipment Lamination/Peeling equipment TWS series Coating and laminating equipment-Part Number-TWS series coating and laminating equipment

TWS series coating and laminating equipment

Available upon quote

Mounted

GLASS. We recommend a large diameter one of 0.5 to 1.0 mm for processing workpieces.

2000 series Φ150~200mm wafer (+1.0)
3000 series Φ200~300mm wafer (+1.0)

Equipped with (no use of organic solvents)

2000 series normal open or double pitch cassette
3000 Series FOUP/FOSB

Safety specification standard

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About Company Handling This Product

TAZMO CO.,LTD.

Company Overview

TAZMO CO., LTD., founded in 1972 and based in Okayama, Japan, is a manufacturer and distributor of advanced ma...

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Semiconductor Inspection Equipment
Semiconductor Inspection Equipment　TAZMO CO.,LTD.
TAZMO CO.,LTD.

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