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Waha chip exterior inspection device (after dating)
Hubrain


About This Product

・ This device is a device that examines the exterior of the chip after waferging. ・ Image resolution can be selected according to the test accuracy. (Approximately 0.8um to 2.0 μm/pixel) Micro test (0.2UM to 2.0um resolution) ・ Simultaneous inspection (optional) Simultaneous inspection ・ NG Chip Revision Function (Optional) ・ NG chip marking function (optional) ・ All number of exclusion Miss / Marking Miss check function (optional) ・ ID reading and mapping data output function (optional) ・ 2 stage specifications that are performed in parallel with the appearance inspection and NG reject. View Wasoft ・ Inspection result map display function ・ NG chip enlarged display function ・ Defective classification display function (defective items/total inspection number/OK/NG)

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    Waha chip exterior inspection device (after dating)

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