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Waha chip exterior inspection device (after dating)-Waha chip exterior inspection device (after dating)
Waha chip exterior inspection device (after dating)-Hubrain

Waha chip exterior inspection device (after dating)
Hubrain


About This Product

・ This device is a device that examines the exterior of the chip after waferging. ・ Image resolution can be selected according to the test accuracy. (Approximately 0.8um to 2.0 μm/pixel) Micro test (0.2UM to 2.0um resolution) ・ Simultaneous inspection (optional) Simultaneous inspection ・ NG Chip Revision Function (Optional) ・ NG chip marking function (optional) ・ All number of exclusion Miss / Marking Miss check function (optional) ・ ID reading and mapping data output function (optional) ・ 2 stage specifications that are performed in parallel with the appearance inspection and NG reject. View Wasoft ・ Inspection result map display function ・ NG chip enlarged display function ・ Defective classification display function (defective items/total inspection number/OK/NG)

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    Waha chip exterior inspection device (after dating)

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1 Models of Waha chip exterior inspection device (after dating)

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Waha chip exterior inspection device (after dating)

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・ Dating ・ Before (crack / chopping) ・ Scratch ・ Discoloration ・ Foreign substance ・ pattern deviation ・ Pattern loss ・ Resistance remaining, poor application, etc.

Multifunctional image inspection software HU-DRA

3.2 million pixels 3cmos Color Area Camera (Test) 16,000 Pixel Monochrome Camera (Press Can)

1,450W × 1,640D × 1,800Hmm, excluding HEPA

・ Exterior inspection time; decomposition ability 1.5 μm Approximately 2 minutes (2inch; chip size about 1mm) ・ exclusion time; 3 to 6 chips/seconds (tip size, type of sheet vary depending on the type of sheet) ・ Marking time

Lens and lighting may be selected depending on the work and the contents of the test.

Various wafer, power semiconductor, CMOS image sensor, LED, photo diode

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