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History
Response Rate
100.0%
Response Time
92.9hours
Product
Flip chip bonder for small devices AFM-15Handling Company
PFA Co., Ltd.Categories
Click on the part number for more information about each product
| Image | Part Number | Price (excluding tax) | Maximum load | Joining method | Target products | Target board | Target chip | Mounting accuracy | Mounting tact | Machine weight | Machine size | Chip supply form |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
AFM-15 1505 |
Available upon quote |
25N (Option: 50N, 100N, 200N, 500N) |
Heat, ultrasonic |
LED, TCXO, SAW, RF, MEMS, CMOS, etc. |
MAX: 180W×120D×3.0T mm |
MAX: 2.5W×2.5D×1.0T mm |
±7μm/3σ (Option:±5μm,±3μm) |
0.78sec/Chip (including process time 0.2sec) |
Approximately 1,800kg |
1,200W×1,504D×1,650H mm |
5,6,8,12 inch wafer etc./5",6",8",12"wafew-ring (option:12wafew-ring ) |
|
|
AFM-15 1508 |
Available upon quote |
25N (Option: 50N, 100N, 200N, 500N) |
Heat, ultrasonic |
LED, TCXO, SAW, RF, MEMS, CMOS, etc. |
MAX: 170W×105D×3.0T mm |
MAX: 2.5W×2.5D×1.0T mm |
±7μm/3σ (Option:±5μm,±3μm) |
0.59sec/Chip (including process time 0.16sec) |
Approximately 1,500kg |
980W×1,040D×1,860H mm |
5,6 inch wafer etc./5",6"wafew-ring |
|
|
AFM-15 1562 |
Available upon quote |
25N (Option: 50N, 100N, 200N, 500N) |
Heat, ultrasonic |
LED, TCXO, SAW, RF, MEMS, CMOS, etc. |
MAX: 180W×120D×3.0T mm |
MAX: 7.0W×7.0D×1.0T mm |
±5μm/3σ (Option:±3μm) |
1.35sec/Chip (including process time 0.4sec) |
Approximately 2,100kg |
1,980W×1,620D×1,566H mm |
8,12 inch wafer etc./8",12"wafew-ring |
Click on the part number for more information about each product
Reviews shown here are reviews of companies.
Reviews shown here are reviews of companies.
Response Rate
100.0%
Response Time
92.9hrs
