Flip chip bonder for small devices AFM-15
PFA Co., Ltd.
About This Product
■Summary
This is a device that performs FC bonding using US bonding (ultrasonic waves) for small electronic devices.
■Features
By increasing ultrasonic efficiency and achieving low-temperature, short-time bonding, it avoids mechanical and thermal residual stress on products and enables stable and high-quality mounting.
■Usage example
It is possible to select the load/ultrasonic head according to the material and product application, and it can be applied to TCXO, SAW filter, LED, C-MOS, etc. Support for up to 12 inch wafers is available as an option.
Product specs
■Standard features
・Preheating table (heating)
・Mounting table (heating)
・Nozzle automatic cleaning
・US management
・Chip height measurement
・Bump detection
・Bad mark detection
・Wafer θ correction
・Wafer expansion
・Hot blow
・Nozzle backside monitoring
・LAN compatible
・Nozzle bonding counter
・Production management information
■Options and special features
・Magazine loader unloader
・Static neutralization blow
・Hepa filter
・Profile monitor
・Supports chip tray
・Map data
・Nozzle heating
・Substrate (package) special holder
・Installation inspection
・Mounting nozzle polishing jig
*Please note that the appearance and specifications may be partially changed in order to improve performance.
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Product
Flip chip bonder for small devices AFM-15
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Handling Company
PFA Co., Ltd.
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Categories
3 Models of Flip chip bonder for small devices AFM-15
Items marked with have different values depending on the model number.
Click on the part number for more information about each product
| Product Image | Part Number | Price (excluding tax) | Chip supply form | Joining method | Machine size | Machine weight | Maximum load | Mounting accuracy | Mounting tact | Target board | Target chip | Target products |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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AFM-15 1505 |
Available upon quote |
5,6,8,12 inch wafer etc./5",6",8",12"wafew-ring (option:12wafew-ring ) Wafer magazine automatic loader/Automatic magazine Loader |
Heat, ultrasonic | 1,200W×1,504D×1,650H mm | Approximately 1,800kg | 25N (Option: 50N, 100N, 200N, 500N) | ±7μm/3σ (Option:±5μm,±3μm) |
0.78sec/Chip (including process time 0.2sec) (Including 0.2sec process time) |
MAX: 180W×120D×3.0T mm MIN: 50W×50D×0.3T mm (Option:8inch wefer substrate) |
MAX: 2.5W×2.5D×1.0T mm MIN: 0.3W×0.3D×0.1T mm (Option:20.0W×20.0D mm) |
LED, TCXO, SAW, RF, MEMS, CMOS, etc. |
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AFM-15 1508 |
Available upon quote |
5,6 inch wafer etc./5",6"wafew-ring Wafer magazine automatic loader/Automatic magazine Loader |
Heat, ultrasonic | 980W×1,040D×1,860H mm | Approximately 1,500kg | 25N (Option: 50N, 100N, 200N, 500N) | ±7μm/3σ (Option:±5μm,±3μm) |
0.59sec/Chip (including process time 0.16sec) (Including 0.16sec process time) |
MAX: 170W×105D×3.0T mm MIN: 50W×50D×0.3T mm |
MAX: 2.5W×2.5D×1.0T mm MIN: 0.3W×0.3D×0.1Tmm (Option:20.0W×20.0D mm) |
LED, TCXO, SAW, RF, MEMS, CMOS, etc. |
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AFM-15 1562 |
Available upon quote |
8,12 inch wafer etc./8",12"wafew-ring Wafer magazine automatic loader/Automatic magazine Loader |
Heat, ultrasonic | 1,980W×1,620D×1,566H mm | Approximately 2,100kg | 25N (Option: 50N, 100N, 200N, 500N) | ±5μm/3σ (Option:±3μm) |
1.35sec/Chip (including process time 0.4sec) (Including 0.4sec process time) |
MAX: 180W×120D×3.0T mm MIN: 50W×50D×0.3T mm (Option:12inch wefer substrate) |
MAX: 7.0W×7.0D×1.0T mm MIN: 2.5W×2.5D×0.1Tmm (Option:20.0W×20.0D mm) |
LED, TCXO, SAW, RF, MEMS, CMOS, etc. |
Click on the part number for more information about each product
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About Company Handling This Product
- Japan