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  2. Sputtering target for semiconductor manufacturing equipment (ULVAC Sales Co., Ltd.)
Sputtering target for semiconductor manufacturing equipment-Sinter-W (5N)
Sputtering target for semiconductor manufacturing equipment-ULVAC Sales Co., Ltd.

Sputtering target for semiconductor manufacturing equipment
ULVAC Sales Co., Ltd.

ULVAC Sales Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

125.8hours

About This Product

■Summary

ULVAC's semiconductor target materials, a leader in cutting-edge thin film materials, are ・Low particles ・Homogeneous film thickness distribution ・High usage efficiency This is a high-quality sputtering target developed and manufactured by considering the manufacturing method for each material with the quality goal in mind. Features

■Sputtering target using optimal manufacturing method

ULVAC has developed two types of tungsten targets with different manufacturing methods depending on the application required in the semiconductor process. (1) Inexpensive high-density tungsten target using powder sintering method for products with purity of 5N grade (2) CVD tungsten target boasting 7N using CVD (vapor phase growth) for parts that require higher quality

■Sputtering target that suppresses particle generation

ULVAC has been developing sputtering targets that suppress the generation of particles, which is a problem during sputtering. In particular, we are working to reduce gas components such as oxygen, which are one of the causes of particle generation, by employing vacuum melting methods in the refining and ingot-forming processes for aluminum targets.

■High homogeneity due to metal structure adjustment

Most semiconductor targets, including ULVAC's high-purity cobalt targets and titanium targets, use manufacturing processes that pay attention to fineness and homogenization of metal structures. For example, in high-purity cobalt targets, the variation in leaking magnetic flux on the target surface is minimized by making the metal structure fine and homogeneous.

■Perfect quality control system

ULVAC conducts integrated manufacturing that takes into account the properties and shapes of the products we handle.

  • Product

    Sputtering target for semiconductor manufacturing equipment

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1 Models of Sputtering target for semiconductor manufacturing equipment

Image Part Number Price (excluding tax) GDMS analysis results U GDMS analysis results Th GDMS analysis results O GDMS analysis results Ni GDMS analysis results Na GDMS analysis results K GDMS analysis results Fe GDMS analysis results Cu GDMS analysis results Cr GDMS analysis results Ca GDMS analysis results C GDMS analysis results Al
Sputtering target for semiconductor manufacturing equipment-Part Number-Sinter-W (5N)

Sinter-W (5N)

Available upon quote

≤0.0005PPM

≤0.0005PPM

≤100PPM

≤1PPM

≤0.1PPM

≤0.1PPM

≤1PPM

≤1PPM

≤1PPM

0.7PPM

≤50PPM

≤1PPM

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About Company Handling This Product

ULVAC Sales Co., Ltd.

Response Rate

100.0%

Response Time

125.8hrs

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