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About This Product
A rigid-flexible board (rigid FPC board) is a board that combines the advantages of a rigid board and a flexible board (FPC board), such as ease of mounting components and three-dimensional arrangement by bending. It usually consists of a rigid part that mounts components and a flex part that bends. In the rigid part, the flexible layer and rigid layer are all stacked on top of each other, and each layer is connected with a TH (through hole). In the case of high-density circuits, the build-up method is applied to this part.
The flex part is made up of only flexible layers so that it can be bent. However, if there are three or more layers of conductors, the flexibility of this flexible layer will be significantly impaired, so each flexible layer consists of two layers as one unit (and If a long service life is required, separate each layer into one unit. Also, since the rigid board and flexible board (FPC board) are integrated, there is no need for a connector between the two boards. Connections between boards can be made without the need for connectors.
In this way, rigid-flexible boards (rigid FPC boards) can have a variety of configurations, and it is technically possible to process all the wiring for one electronic device on one multilayer rigid-flexible board (multilayer rigid FPC board). It is possible. We manufacture products in a variety of shapes, including folding types and book binder types.
Standard specifications
■Base material (3-layer material/2-layer material)
・Polyimide film: 12.5μm (1/2mil), 25μm (1mil), 50μm (2mil)
・Electrolytic copper foil/rolled copper foil: 9μm (1/4oz), 12μm (1/3oz), 17.5μm (1/2oz), 35μm (1oz)
■Cover material
・Polyimide film: 12.5μm (1/2mil), 25μm (1mil), 50μm (2mil)
・Cover coat: Photo solder resist
■Surface treatment
・Rust prevention treatment: Rust prevention treatment, heat-resistant rust prevention treatment
・Solder treatment: cream solder
・Plating processing: Electrolytic direct gold plating, electrolytic nickel/gold plating, electroless nickel/gold plating, soft gold plating, tin plating, solder plating (PB free), flux
■Reinforcement material
・Reinforcement film: polyimide, polyester
・Reinforcement plate: glass epoxy, polyimide
・Metal reinforcement plate: aluminum, SUS
■Number of layers that can be manufactured
Number of layers: 3-10 layers
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