Thin film production equipment 4-element magnetron sputtering equipment
Kitano Seiki Co., Ltd.
About This Product
This equipment is a Brainer type magnetron sputtering equipment that uses a DC magnetron sputtering source. This is an ultra-high vacuum compatible type that has our own load lock chamber. It has a sample rotation type that allows for uniform film formation during film formation.
In addition, sample cooling is possible while rotating to eliminate sample damage. The structure allows up to four targets to be attached, allowing multilayer film formation. It is a multi-chamber compatible type with future prospects in mind, so it can be easily connected to the equipment you are currently using.
■Specifications
・All vacuum components except the vacuum gauge can be repeatedly baked at temperatures above 200℃.
・Ultra-high vacuum compatible chamber, leak amount by He leak detector is 1.33×10^-11Pa・m3/sec or less
・You can use a board holder (made by Mo) that supports 2-inch boards.
・The substrate holder can be safely transported manually to the holder fixing mechanism on the sample stage using our optional transfer rod.
・The pedestal is equipped with casters and level adjustment function.
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Product
Thin film production equipment 4-element magnetron sputtering equipment
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Handling Company
Kitano Seiki Co., Ltd.
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Categories
1 Models of Thin film production equipment 4-element magnetron sputtering equipment
| Product Image | Part Number | Price (excluding tax) | 3-axis manipulator R direction | 3-axis manipulator Z direction | 3-axis manipulator tilt direction | AC100V | AC200V | Bottom flange port | Compressed air | Film thickness sensor movement mechanism | Liquid nitrogen shroud leakage amount | Liquid nitrogen shroud material | Liquid nitrogen shroud method | Liquid nitrogen shroud treatment | Lower flange high temperature treatment | Lower flange leakage amount | Lower flange material | Lower flange shape | Lower flange surface treatment | Main shutter mechanism method | Motor controller | Sample heating heater Heater material | Sample heating heater method | Sample heating heater reached temperature | Trestle | Ultra-high vacuum chamber high temperature treatment | Ultra-high vacuum chamber leakage amount | Ultra-high vacuum chamber material | Ultra-high vacuum chamber port | Ultra-high vacuum chamber shape | Ultra-high vacuum chamber surface treatment | Ultra-high vacuum chamber ultimate vacuum |
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Quaternary magnetron sputtering equipment |
Available upon quote | 360° (∞) (rotating platform KMRP-114) motor drive | 100mm (vertical mechanism KUD-114/100Z) motor drive | 90° (vertical mechanism KUD-114/70SP) motor drive | Single phase 30A | Three phase 20A | ICF-203, ICF-152, ICF-114, ICF-70 | 5kg/cm2 |
Sensor: Crystal oscillator (optional) Mounting flange: ICF-70 Travel distance: 100mm (accuracy 0.1mm) |
5×10^-8Pa・m3/sec | Stainless steel 316L | Liquid nitrogen storage type (uses 8/3″ pipe) | Buffing mirror finish, heat cycle treatment (10 times) | Vacuum baking at 450℃ x 48 hours or more | 5×10^-11Pa・m3/sec | SUS316L | ICF-356/152×4/70×1 | Composite electrolytic polishing mirror finish | Transfer rod method (optional/motor drive) |
Controller for stepping motor Comes with special box |
Ta (heater part) Molybdenum (main body) A rotary joint is used for the electrode. |
Claw retainer type | Base surface temperature Max1,200℃ |
Material: SS material/Baked paint treatment (black) Dimensions: 600 x 1,200 x 1,500 (with casters and adjusters) |
Vacuum baking at 450℃ x 48 hours or more | 5×10^-11Pa・m3/sec | SUS316L | ICF-203, ICF-152, ICF-114, ICF-70 | ICF-356-N Special/203/152/114/70 | Composite electrolytic polishing mirror finish | 1×10^-11Torr or less (when using liquid nitrogen shroud cooling and turbo molecular pump of 300l/s or more or ion pump of 300l/s or more) |
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About Company Handling This Product
- Japan