All Categories

History

  1. Metoree
  2. Semiconductor Manufacturing
  3. Semiconductor Manufacturing Equipment Component & Part Machining
  4. Tabletop silane CVD film deposition equipment EcoCoat (HiSOL,Inc.)
Tabletop silane CVD film deposition equipment EcoCoat-EcoCoat
Tabletop silane CVD film deposition equipment EcoCoat-HiSOL,Inc.

Tabletop silane CVD film deposition equipment EcoCoat
HiSOL,Inc.

HiSOL,Inc.'s Response Status

Response Rate

100.0%

Response Time

40.5hours

About This Product

This is a tabletop silane CVD device for R&D that can perform automatic batch processing from plasma cleaning to workpiece dehydration to silane CVD to gas discharge in a chamber. A SAM film (self-assembled monolayer), which is effective for bonding inorganic and organic materials, is formed on a substrate. All process parameters such as workpiece temperature, steam temperature, steam pressure, and CVD treatment time can be controlled to obtain optimal surface treatment results for various applications. It is a small tabletop system that is ideal for R&D and small-volume production regardless of the installation location.

■Application

・Formation of SAM film (self-assembled monolayer) ・Silane coupling treatment (effective for chemical bonding of organic and inorganic substances) ・Surface modification treatment (hydrophilic/hydrophobic control) ・Silan coating on slide glass ・Improved wafer photoresist adhesion (HMDS treatment) ・Adhesion of microarray silane and substrate ・MEMS coating to prevent friction damage (stiction) ・Drift prevention coating for bioMEMS and biosensors ・Anti-corrosion (anti-rust) coating for metal materials ・Improved biocompatibility etc…

■Features

・Aminosilane, epoxysilane, mercaptosilane, APTES, FDTS etc...A variety of silane coupling agents can be used depending on the application ・All parameters such as workpiece temperature, steam temperature, steam pressure, and CVD processing time can be controlled to obtain optimal surface treatment results. ・Formation of even film with high temperature stability ・Very high safety as all processes are automatically batch processed inside the chamber ・The vapor prime method reduces the amount of chemical used by approximately 99% compared to the spin coating method, and can process three-dimensional structures such as MEMS without any problems. ・High versatility due to low temperature process deposition below 205℃

■Plasma cleaning before CVD process

YES's plasma cleaning process has the following features, making it a device that can handle any workpiece.

■40kHz low frequency plasma

Compared to 13.56MHz high-frequency plasma, plasma processing is more efficient with less heat loss. (Achieves high processing results with low power consumption)

■Parallel plate chamber design

The tray can be laid out according to the size (height) of the workpiece. Plasma is generated over the entire surface between the trays that serve as electrodes, resulting in high temperature stability and highly reproducible processing results.

  • Product

    Tabletop silane CVD film deposition equipment EcoCoat

Share this product


140+ people viewing

Last viewed: 23 hours ago

Free
Get started with our free quotation service - no cost, no obligation.

No Phone Required
We respect your privacy. You can receive quotes without sharing your phone number.

1 Models of Tabletop silane CVD film deposition equipment EcoCoat

Image Part Number Price (excluding tax) Power supply Applicable clean room Number of chemicals (number of flasks) Chemical consumption Temperature stability Body size (approx.) W×D×H Time setting resolution Operating temperature Number of recipes Mass flow controller Process time Process gas input port Plasma gas input port Chamber size (approx.) W×D×H Throughput Capacity (for slides, trays and shelves are required) Capacity (25 wafers/cassette) RF plasma frequency RF plasma power
Tabletop silane CVD film deposition equipment EcoCoat-Part Number-EcoCoat

EcoCoat

Available upon quote

Single phase 208V, 30A, 60Hz

Class 10

2 pieces (optional max. 3 pieces)

0.1 – 3ml

±5℃

116×98×113cm

1 second

Room temperature – 205℃

・CVD: 6 recipes
・Plasma: 4 recipes

Up to 3 options

1 – 999,999 seconds

1 piece

3 pieces

41×46×41cm

1 batch / hour (depending on the recipe you set)

Approximately 2,000 pieces

4″,6″ wafer 8 cassettes
8″ wafer 2 cassettes
12″ wafer 1 cassette

40kHz

100 -1,000W

Customers who viewed this product also viewed

Reviews shown here are reviews of companies.

Semiconductor manufacturing equipment High performance single wafer atmospheric pressure CVD (APCVD) equipment (A200V)-M.WATANABE & CO.,LTD.

Semiconductor manufacturing equipment High performance single wafer atmospheric pressure CVD (APCVD) equipment (A200V)

M.WATANABE & CO.,LTD.

50+ people viewing

Last viewed: 11 hours ago

Response time: 60.53 hours

Semiconductor Manufacturing Equipment Component & Part Machining

2 models listed

Organic EL prototype device manufacturing equipment Organic EL film formation/evaluation equipment I OED R&D System I-Kitano Seiki Co., Ltd.

Organic EL prototype device manufacturing equipment Organic EL film formation/evaluation equipment I OED R&D System I

Kitano Seiki Co., Ltd.

40+ people viewing

Last viewed: 8 hours ago

Response time: 50.88 hours

Semiconductor Manufacturing Equipment Component & Part Machining

2 models listed

Semiconductor manufacturing equipment High productivity continuous atmospheric pressure CVD (APCVD) equipment (AMAX800V)-M.WATANABE & CO.,LTD.

Semiconductor manufacturing equipment High productivity continuous atmospheric pressure CVD (APCVD) equipment (AMAX800V)

M.WATANABE & CO.,LTD.

50+ people viewing

Last viewed: 4 hours ago

Response time: 60.53 hours

Semiconductor Manufacturing Equipment Component & Part Machining

2 models listed

Semiconductor manufacturing equipment Lamination/Peeling equipment TWH-SR-CC series Support mechanical peeling/cleaning integrated equipment-TAZMO CO.,LTD.

Semiconductor manufacturing equipment Lamination/Peeling equipment TWH-SR-CC series Support mechanical peeling/cleaning integrated equipment

TAZMO CO.,LTD.

100+ people viewing

Last viewed: 6 hours ago

Semiconductor Manufacturing Equipment Component & Part Machining

3 models listed

12 inch compatible wafer wax applicator TEC-1001MB-Kumasan Medix Co., Ltd.

12 inch compatible wafer wax applicator TEC-1001MB

Kumasan Medix Co., Ltd.

460+ people viewing

Last viewed: 10 hours ago

Semiconductor Manufacturing Equipment Component & Part Machining
Factory system Semiconductor manufacturing equipment-Aynac System Co., Ltd.

Factory system Semiconductor manufacturing equipment

Aynac System Co., Ltd.

240+ people viewing

Last viewed: 6 hours ago

Semiconductor Manufacturing Equipment Component & Part Machining
Wafer level burn-in for various devices and elements-Semi Next Co., Ltd.

Wafer level burn-in for various devices and elements

Semi Next Co., Ltd.

150+ people viewing

Semiconductor Manufacturing Equipment Component & Part Machining
Semiconductor manufacturing equipment PEGASUS-Cellback Co., Ltd.

Semiconductor manufacturing equipment PEGASUS

Cellback Co., Ltd.

20+ people viewing

Last viewed: 9 hours ago

Semiconductor Manufacturing Equipment Component & Part Machining
UV irradiation device for peeling dicing tape-Nanyo Co., Ltd.

UV irradiation device for peeling dicing tape

Nanyo Co., Ltd.

5.0

130+ people viewing

Last viewed: 1 hour ago

Response time: 105.08 hours

Semiconductor Manufacturing Equipment Component & Part Machining

3 models listed

Organic EL prototype device manufacturing equipment Organic EL film formation/evaluation equipment II OED R&D System II-Kitano Seiki Co., Ltd.

Organic EL prototype device manufacturing equipment Organic EL film formation/evaluation equipment II OED R&D System II

Kitano Seiki Co., Ltd.

30+ people viewing

Last viewed: 5 hours ago

Response time: 50.88 hours

Semiconductor Manufacturing Equipment Component & Part Machining

2 models listed

Semiconductor manufacturing equipment High productivity continuous atmospheric pressure CVD (APCVD) equipment (AMAX1200)-M.WATANABE & CO.,LTD.

Semiconductor manufacturing equipment High productivity continuous atmospheric pressure CVD (APCVD) equipment (AMAX1200)

M.WATANABE & CO.,LTD.

60+ people viewing

Last viewed: 21 hours ago

Response time: 60.53 hours

Semiconductor Manufacturing Equipment Component & Part Machining

2 models listed

Ultrasonic metal joining device for power devices (Ultrasonic Metal Bonder)-Adwells Co., Ltd.

Ultrasonic metal joining device for power devices (Ultrasonic Metal Bonder)

Adwells Co., Ltd.

170+ people viewing

Response time: 126.64 hours

Semiconductor Manufacturing Equipment Component & Part Machining

3 models listed

See More Semiconductor Manufacturing Equipment Component & Part Machining Products

Other products of HiSOL,Inc.

Reviews shown here are reviews of companies.

Probe card-HiSOL,Inc.

Probe card

HiSOL,Inc.

30+ people viewing

Last viewed: 6 hours ago

Response time: 40.54 hours

Probe Cards
Atmospheric pressure lamp annealing equipment RTP/RTA 8 inch compatible AccuThermo AW820M-HiSOL,Inc.

Atmospheric pressure lamp annealing equipment RTP/RTA 8 inch compatible AccuThermo AW820M

HiSOL,Inc.

30+ people viewing

Last viewed: 7 minutes ago

Response time: 40.54 hours

Annealing Furnaces
IC socket burn-in test-HiSOL,Inc.

IC socket burn-in test

HiSOL,Inc.

30+ people viewing

Response time: 40.54 hours

BGA Scokets

2 models listed

Capillary for ball bonding-HiSOL,Inc.

Capillary for ball bonding

HiSOL,Inc.

30+ people viewing

Response time: 40.54 hours

Capillaries
Tabletop UV curing furnace lamp type UV PITARI-HiSOL,Inc.

Tabletop UV curing furnace lamp type UV PITARI

HiSOL,Inc.

30+ people viewing

Response time: 40.54 hours

Ultraviolet (UV) Dryers
Measuring Instruments/Measuring Systems Ellipsometer-HiSOL,Inc.

Measuring Instruments/Measuring Systems Ellipsometer

HiSOL,Inc.

30+ people viewing

Last viewed: 10 seconds ago

Response time: 40.54 hours

Ellipsometers
Laser microprocessing equipment-HiSOL,Inc.

Laser microprocessing equipment

HiSOL,Inc.

30+ people viewing

Last viewed: 22 hours ago

Response time: 40.54 hours

Microfabrication Machines
Tabletop multi-wire bonder (ball & wedge type) MODEL-7KE-HiSOL,Inc.

Tabletop multi-wire bonder (ball & wedge type) MODEL-7KE

HiSOL,Inc.

90+ people viewing

Last viewed: 13 hours ago

Response time: 40.54 hours

Semiconductor Manufacturing Equipment Component & Part Machining

3 models listed

Desktop manual wedge bonder E series-HiSOL,Inc.

Desktop manual wedge bonder E series

HiSOL,Inc.

90+ people viewing

Last viewed: 22 minutes ago

Response time: 40.54 hours

Wire Bonders
Tabletop manual deep access wedge bonder MODEL-7476D (7600D specification)-HiSOL,Inc.

Tabletop manual deep access wedge bonder MODEL-7476D (7600D specification)

HiSOL,Inc.

110+ people viewing

Last viewed: 4 minutes ago

Response time: 40.54 hours

Wire Bonders
Die Bonder Epoxy Die Bonder Model 7200CR-HiSOL,Inc.

Die Bonder Epoxy Die Bonder Model 7200CR

HiSOL,Inc.

30+ people viewing

Response time: 40.54 hours

Auto flip chip bonder MODEL-400-HiSOL,Inc.

Auto flip chip bonder MODEL-400

HiSOL,Inc.

100+ people viewing

Last viewed: 15 minutes ago

Response time: 40.54 hours

Flip Chip Bonders

2 models listed


View more products of HiSOL,Inc.

About Company Handling This Product

HiSOL,Inc.

Response Rate

100.0%

Response Time

40.5hrs

Company Overview

Hisol Inc., established in 1967 as Kan Electronics, is a manufacturer based in Tokyo, Japan, producing machine...

See More

  • Japan

Related search keywords

Semiconductor Manufacturing Equipment Component & Part Machining
Semiconductor Manufacturing Equipment Component & Part Machining　HiSOL,Inc.
HiSOL,Inc.

This is the version of our website addressed to speakers of English in the United States. If you are a resident of another country, please select the appropriate version of Metoree for your country in the drop-down menu.

Copyright © 2024 Metoree