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  4. Lapping/polishing equipment Wafer cleaning equipment ParticleClean (HiSOL,Inc.)
Lapping/polishing equipment Wafer cleaning equipment ParticleClean-ParticleClean
Lapping/polishing equipment Wafer cleaning equipment ParticleClean-HiSOL,Inc.

Lapping/polishing equipment Wafer cleaning equipment ParticleClean
HiSOL,Inc.

HiSOL,Inc.'s Response Status

Response Rate

100.0%

Response Time

40.5hours

About This Product

This is a tabletop cleaning device that is ideal for research and development. It can be used as an alternative to hand washing, such as when cleaning wafers after polishing such as CMP.

■Features

・Double cleaning with scrub and two fluids (mist) gently and powerfully removes particles -The weight of the main unit is approximately 30kg. Small body allows you to use it anywhere ・Automatic processing from cleaning to spin drying by simply setting the sample and pressing a button ・Complete safety measures (water leakage sensor, lid opening/closing sensor, flow rate/pressure sensor, built-in HEPA filter, etc...)

■What is the difference between hand washing and washing equipment?

The abrasives used in CMP etc. contain colloidal particles, which cannot be removed once they dry. Therefore, it is necessary to clean the specimen immediately after polishing is completed. Hand-washing, which involves simply cleaning with a water gun, may not completely remove the particles contained in the abrasive, which may have a negative impact on the next manufacturing process. HySol's ParticleClean performs scrub cleaning with a soft PVA pad and further performs two-fluid cleaning that collides with pure water mist at high speed, making it possible to powerfully clean the sample surface without damaging it. In addition to cleaning, it also supports spin drying, so a series of processes such as ``scrubbing'', ``two-fluid cleaning'', ``rinsing'', and ``drying'' can be performed with one device. Additionally, by saving the process recipe, even if the type of sample changes, cleaning can be started simply by calling up the recipe.

■Automatic from washing to drying

Many benefits hidden in a simple structure ・Achieves a high-level surface condition without artificial variations in cleaning quality ・Select the most suitable brush according to the sample, such as PVA or ultra-fine nylon. ・Deep water mist collides with the sample at high speed 2. Significant "water saving effect" due to fluid cleaning ・Flexible design to accommodate various sample sizes ・Safety mechanism that prevents the process from starting when the lid is open due to a sensor ・Lid lock mechanism that prevents the lid from opening during process operation

  • Product

    Lapping/polishing equipment Wafer cleaning equipment ParticleClean

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1 Models of Lapping/polishing equipment Wafer cleaning equipment ParticleClean

Image Part Number Price (excluding tax) Power supply Material of the device body Body weight Body size Compatible wafer size
Lapping/polishing equipment Wafer cleaning equipment ParticleClean-Part Number-ParticleClean

ParticleClean

Available upon quote

100VAC 50/60Hz, 15A

PVC

Approximately 30kg

800mm (W) x450mm (D) x567mm (H)

Maximum 6 inch wafer (individual pieces possible)

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About Company Handling This Product

HiSOL,Inc.

Response Rate

100.0%

Response Time

40.5hrs

Company Overview

Hisol Inc., established in 1967 as Kan Electronics, is a manufacturer based in Tokyo, Japan, producing machine...

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  • Japan

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Cleaning Systems　HiSOL,Inc.
HiSOL,Inc.

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