All Categories

History

  1. Metoree
  2. Semiconductor Manufacturing
  3. Flip Chip Bonders
  4. Wafer bonding equipment WSB2 Wafer bonder 1WBS2 (4 inch type) (HiSOL,Inc.)
Wafer bonding equipment WSB2 Wafer bonder 1WBS2 (4 inch type)-1WBS2
Wafer bonding equipment WSB2 Wafer bonder 1WBS2 (4 inch type)-HiSOL,Inc.

Wafer bonding equipment WSB2 Wafer bonder 1WBS2 (4 inch type)
HiSOL,Inc.

HiSOL,Inc.'s Response Status

Response Rate

100.0%

Response Time

28.6hours

Relatively Fast Response

About This Product

Wafer bonders from Logitech (UK), a company with over 50 years of experience in the polishing industry, solve your polishing problems. If the thickness of the wax varies when bonding the sample and support substrate together with wax before polishing, it will affect the accuracy of polishing. Logitech's wafer bonder heats it in a vacuum chamber and applies a load with a diaphragm. Load is applied uniformly to the sample and voids are eliminated, allowing for highly accurate polishing.

■Features

-By applying the load using a soft diaphragm, the load can be applied uniformly over the surface even if the target is a wafer. By curing the wax while maintaining a constant pressure, it eliminates variations in wax thickness and enables high-precision polishing. ・By heating in a vacuum chamber, voids in the wax can be removed and the thickness of the wax can be made uniform. Additionally, circulating cooling water reduces the curing time. ・Parameters such as pressurization time can be set on the touch panel. It is also possible to set conditions such as heating, pressurizing, outgassing, curing, and cooling process times and save recipes.

  • Product

    Wafer bonding equipment WSB2 Wafer bonder 1WBS2 (4 inch type)

Share this product


50+ people viewing

Free
Get started with our free quotation service - no cost, no obligation.

No Phone Required
We respect your privacy. You can receive quotes without sharing your phone number.

1 Models of Wafer bonding equipment WSB2 Wafer bonder 1WBS2 (4 inch type)

Image Part Number Price (excluding tax) Power supply Degree of vacuum Body weight Body size Board size Heating temperature Pressurization Utility Option
Wafer bonding equipment WSB2 Wafer bonder 1WBS2 (4 inch type)-Part Number-1WBS2

1WBS2

Available upon quote

110V 50/60Hz

0.2mbar

Approximately 27kg

520 (W) x360 (H) x600mm (D)

Maximum 108mmΦ

Maximum 240℃

Max 2bar

Cooling water, compressed air

·compressor
・Alignment jig

Customers who viewed this product also viewed

Reviews shown here are reviews of companies.

Flip chip bonder YSB55w-Yamaha Robotics Holdings Co., Ltd.

Flip chip bonder YSB55w

Yamaha Robotics Holdings Co., Ltd.

110+ people viewing

Last viewed: 30 minutes ago

Response time: 39.31 hours

Flip Chip Bonders
Flip chip bonder for small devices AFM-15-PFA Co., Ltd.

Flip chip bonder for small devices AFM-15

PFA Co., Ltd.

350+ people viewing

Last viewed: 3 minutes ago

Response time: 92.87 hours

Flip Chip Bonders

6 models listed

Ultra-high precision die bonder with advanced pickup function SPA-1000-Yamaha Robotics Holdings Co., Ltd.

Ultra-high precision die bonder with advanced pickup function SPA-1000

Yamaha Robotics Holdings Co., Ltd.

120+ people viewing

Last viewed: 31 minutes ago

Response time: 39.31 hours

Flip Chip Bonders

2 models listed

High-speed, high-precision small chip die bonder STC-800-Yamaha Robotics Holdings Co., Ltd.

High-speed, high-precision small chip die bonder STC-800

Yamaha Robotics Holdings Co., Ltd.

140+ people viewing

Last viewed: 27 minutes ago

Response time: 39.31 hours

Flip Chip Bonders

2 models listed

Manual flip chip placement system Model 850 with excellent ease of use and positioning accuracy-Hugle Electronics Co., Ltd.

Manual flip chip placement system Model 850 with excellent ease of use and positioning accuracy

Hugle Electronics Co., Ltd.

60+ people viewing

Last viewed: 33 minutes ago

Response time: 51.55 hours

Flip Chip Bonders

2 models listed

Perform eutectic, ultrasonic, epoxy, thermocompression, and solder flip bonding in one system Flip Chip Bonder Model 865-Hugle Electronics Co., Ltd.

Perform eutectic, ultrasonic, epoxy, thermocompression, and solder flip bonding in one system Flip Chip Bonder Model 865

Hugle Electronics Co., Ltd.

80+ people viewing

Last viewed: 12 minutes ago

Response time: 51.55 hours

Flip Chip Bonders

2 models listed

Tabletop manual ball wire & bump bonder MODEL-7700D-HiSOL,Inc.

Tabletop manual ball wire & bump bonder MODEL-7700D

HiSOL,Inc.

240+ people viewing

Last viewed: 7 hours ago

Response time: 28.63 hours

Flip Chip Bonders

4 models listed

Ultra-high precision mounting machine flip chip bonder M1300-HiSOL,Inc.

Ultra-high precision mounting machine flip chip bonder M1300

HiSOL,Inc.

140+ people viewing

Last viewed: 4 hours ago

Response time: 28.63 hours

Flip Chip Bonders
Auto flip chip bonder MODEL-400-HiSOL,Inc.

Auto flip chip bonder MODEL-400

HiSOL,Inc.

190+ people viewing

Last viewed: 32 minutes ago

Response time: 28.63 hours

Flip Chip Bonders

2 models listed

Tabletop flip chip bonder M90 for research and development-HiSOL,Inc.

Tabletop flip chip bonder M90 for research and development

HiSOL,Inc.

200+ people viewing

Last viewed: 16 minutes ago

Response time: 28.63 hours

Flip Chip Bonders

2 models listed

WSB2 Wafer bonding equipment WSB2 Wafer bonder 1WBS7 (6 inch type)-HiSOL,Inc.

WSB2 Wafer bonding equipment WSB2 Wafer bonder 1WBS7 (6 inch type)

HiSOL,Inc.

30+ people viewing

Last viewed: 10 minutes ago

Response time: 28.63 hours

Flip Chip Bonders
Die bonder tabletop manual eutectic die bonder (6 types collet type) model 7327C-HiSOL,Inc.

Die bonder tabletop manual eutectic die bonder (6 types collet type) model 7327C

HiSOL,Inc.

70+ people viewing

Last viewed: 10 hours ago

Response time: 28.63 hours

Flip Chip Bonders
See More Flip Chip Bonders Products

Other products of HiSOL,Inc.

Reviews shown here are reviews of companies.

Probe card-HiSOL,Inc.

Probe card

HiSOL,Inc.

130+ people viewing

Last viewed: 3 hours ago

Response time: 28.63 hours

Probe Cards

2 models listed

Atmospheric pressure lamp annealing equipment RTP/RTA 8 inch compatible AccuThermo AW820M-HiSOL,Inc.

Atmospheric pressure lamp annealing equipment RTP/RTA 8 inch compatible AccuThermo AW820M

HiSOL,Inc.

90+ people viewing

Last viewed: 4 hours ago

Response time: 28.63 hours

Annealing Furnaces
IC socket burn-in test-HiSOL,Inc.

IC socket burn-in test

HiSOL,Inc.

100+ people viewing

Last viewed: 43 minutes ago

Response time: 28.63 hours

BGA Scokets

2 models listed

Capillary for ball bonding-HiSOL,Inc.

Capillary for ball bonding

HiSOL,Inc.

100+ people viewing

Last viewed: 40 minutes ago

Response time: 28.63 hours

Capillaries
Tabletop UV curing furnace lamp type UV PITARI-HiSOL,Inc.

Tabletop UV curing furnace lamp type UV PITARI

HiSOL,Inc.

100+ people viewing

Last viewed: 11 hours ago

Response time: 28.63 hours

Ultraviolet (UV) Dryers

2 models listed

Measuring Instruments/Measuring Systems Ellipsometer-HiSOL,Inc.

Measuring Instruments/Measuring Systems Ellipsometer

HiSOL,Inc.

90+ people viewing

Last viewed: 9 minutes ago

Response time: 28.63 hours

Ellipsometers
Laser microprocessing equipment-HiSOL,Inc.

Laser microprocessing equipment

HiSOL,Inc.

90+ people viewing

Last viewed: 3 hours ago

Response time: 28.63 hours

Microfabrication Machines
Tabletop multi-wire bonder (ball & wedge type) MODEL-7KE-HiSOL,Inc.

Tabletop multi-wire bonder (ball & wedge type) MODEL-7KE

HiSOL,Inc.

180+ people viewing

Last viewed: 50 minutes ago

Response time: 28.63 hours

Semiconductor Manufacturing Equipment Component & Part Machining

3 models listed

Desktop manual wedge bonder E series-HiSOL,Inc.

Desktop manual wedge bonder E series

HiSOL,Inc.

150+ people viewing

Last viewed: 11 hours ago

Response time: 28.63 hours

Wire Bonders
Tabletop manual deep access wedge bonder MODEL-7476D (7600D specification)-HiSOL,Inc.

Tabletop manual deep access wedge bonder MODEL-7476D (7600D specification)

HiSOL,Inc.

180+ people viewing

Last viewed: 15 hours ago

Response time: 28.63 hours

Wire Bonders
Die Bonder Epoxy Die Bonder Model 7200CR-HiSOL,Inc.

Die Bonder Epoxy Die Bonder Model 7200CR

HiSOL,Inc.

80+ people viewing

Last viewed: 23 minutes ago

Response time: 28.63 hours

Flip Chip Bonders
Auto flip chip bonder MODEL-400-HiSOL,Inc.

Auto flip chip bonder MODEL-400

HiSOL,Inc.

190+ people viewing

Last viewed: 32 minutes ago

Response time: 28.63 hours

Flip Chip Bonders

2 models listed


View more products of HiSOL,Inc.

About Company Handling This Product

HiSOL,Inc.

Response Rate

100.0%

Response Time

28.6hrs

Company Overview

Hisol Inc., established in 1967 as Kan Electronics, is a manufacturer based in Tokyo, Japan, producing machine...

See More

  • Japan

Related search keywords

Flip Chip Bonders
Flip Chip Bonders　HiSOL,Inc.
HiSOL,Inc.

This is the version of our website addressed to speakers of English in the United States. If you are a resident of another country, please select the appropriate version of Metoree for your country in the drop-down menu.

Copyright © 2025 Metoree