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  4. Lapping/polishing equipment PM6/LP70 series Tabletop precision polishing equipment LP70 (HiSOL,Inc.)
Lapping/polishing equipment PM6/LP70 series Tabletop precision polishing equipment LP70-LP70
Lapping/polishing equipment PM6/LP70 series Tabletop precision polishing equipment LP70-HiSOL,Inc.

Lapping/polishing equipment PM6/LP70 series Tabletop precision polishing equipment LP70
HiSOL,Inc.

HiSOL,Inc.'s Response Status

Response Rate

100.0%

Response Time

40.5hours

About This Product

PM6/LP70 is a precision polishing device that can perform lapping (rough polishing) and polishing in one machine. By using the chemical-resistant model, CMP (Chemical Mechanical Polishing) is also possible, making it ideal for precision polishing of compound semiconductors such as GaAs and InP.

■Ultra-precision polishing jig that achieves high-precision polishing

The specially constructed jig, hand-manufactured by skilled engineers, uses a unique spring mechanism to apply the load evenly over the entire surface of the sample. For example, even if you try to attach a jig that separates the male and female parts from a piston to another jig, the jigs are precisely machined in pairs by engineers, so even if they are the same model, you will not be able to attach them. I can't. A jig that has been precisely machined to such an extent enables highly accurate polishing.

■Other features

・Load variable: 200g to 6.7kg (varies depending on the type of jig) ・Angle adjustment: ±3° (D style), ±1.5° (GT style) ・Digital display of polishing amount (1um order)

■Precision polishing jig with automatic device stop function

It communicates with the device and automatically stops the device when the set amount of polishing is reached, making unattended polishing possible. Polishing data is also saved even if the equipment suddenly stops.

■Easy control with touch panel

Set the following parameters using the touch panel. ・Rotation speed of polishing plate and jig roller ・Polishing time ・Amount of polishing ・Jig arm sweep (sweep width, speed) ・Slurry dropping amount/polishing liquid switching ・Target flatness of lapping plate (optional) ・Process recipe settings ・Chart display of polishing rate

■Characteristics of LP70

・With the ability to average the polishing removal amount data, it is possible to polish while controlling the sample thickness with high precision even when using slurry with large particle size or when polishing using a soft pad. -Target polishing amount can be set for each jig. You can also set the average value for all jigs, so you can, for example, stop when the average amount of polishing for all jigs reaches 10um.

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    Lapping/polishing equipment PM6/LP70 series Tabletop precision polishing equipment LP70

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1 Models of Lapping/polishing equipment PM6/LP70 series Tabletop precision polishing equipment LP70

Image Part Number Price (excluding tax) Height Power supply Width Depth Jig type Plate flatness monitor Plate rotation Plate size
Lapping/polishing equipment PM6/LP70 series Tabletop precision polishing equipment LP70-Part Number-LP70

LP70

Available upon quote

1,000mm

110V, 50/60Hz

950mm

730mm

PP5 (x1~4), PP6 (x1~4), PP8 (x1~2)

0.1um resolution

5–100rpm

400mm

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About Company Handling This Product

HiSOL,Inc.

Response Rate

100.0%

Response Time

40.5hrs

Company Overview

Hisol Inc., established in 1967 as Kan Electronics, is a manufacturer based in Tokyo, Japan, producing machine...

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  • Japan

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