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  2. Semiconductor Manufacturing
  3. Flip Chip Bonders
  4. Tabletop flip chip bonder M90 for research and development (HiSOL,Inc.)
Tabletop flip chip bonder M90 for research and development-M90
Tabletop flip chip bonder M90 for research and development-M95
Tabletop flip chip bonder M90 for research and development-HiSOL,Inc.

Tabletop flip chip bonder M90 for research and development
HiSOL,Inc.

HiSOL,Inc.'s Response Status

Response Rate

100.0%

Response Time

40.5hours

About This Product

The PC software operation system allows for easy and highly reproducible implementation. Ideal for optical component mounting, MEMS device assembly, multi-pin BGA mounting, etc. Wide range load model covering up to 400 newtons.

■Features

・Die bonding and flip chip bonding functions - Compatible with a variety of devices by replacing stage and collet parts. - Compatible with various construction methods such as thermocompression bonding, adhesive coating, metal eutectic, and ultrasonic bonding. - Ideal for creating prototypes, developing conditions, and setting conditions for mass production equipment.

  • Product

    Tabletop flip chip bonder M90 for research and development

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2 Models of Tabletop flip chip bonder M90 for research and development

Click on the part number for more information about each product

Image Part Number Price (excluding tax) Applied load Alignment accuracy Alignment Function
Tabletop flip chip bonder M90 for research and development-Part Number-M90

M90

Available upon quote

50-2,000g

±2.5μm

Manual

Manual type FC bonder

Tabletop flip chip bonder M90 for research and development-Part Number-M95

M95

Available upon quote

300-40,000g

±2.5μm

Manual

Manual type FC bonder

Click on the part number for more information about each product

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About Company Handling This Product

HiSOL,Inc.

Response Rate

100.0%

Response Time

40.5hrs

Company Overview

Hisol Inc., established in 1967 as Kan Electronics, is a manufacturer based in Tokyo, Japan, producing machine...

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  • Japan

Related search keywords

Flip Chip Bonders
Flip Chip Bonders　HiSOL,Inc.
HiSOL,Inc.

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