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100.0%
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40.5hours
Product
Auto flip chip bonder MODEL-400Handling Company
HiSOL,Inc.Categories
Click on the part number for more information about each product
Image | Part Number | Price (excluding tax) | Applied load | Type | Alignment accuracy | Alignment | Function |
---|---|---|---|---|---|---|---|
M400α |
Available upon quote |
50-1,000g |
Automatic flip chip bonder |
±2.5μm |
Automatic |
Fully automatic bonding or |
|
M400TR |
Available upon quote |
50-1,000g |
Automatic chip transfer machine |
±5μm |
Automatic |
Fully automatic wafer → chip tray |
Click on the part number for more information about each product
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Reviews shown here are reviews of companies.