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Auto flip chip bonder MODEL-400-M400α
Auto flip chip bonder MODEL-400-M400TR
Auto flip chip bonder MODEL-400-HiSOL,Inc.

Auto flip chip bonder MODEL-400
HiSOL,Inc.

HiSOL,Inc.'s Response Status

Response Rate

100.0%

Response Time

40.5hours


About This Product

2-8 A wide range of handling/mounting is possible by replacing adapters, regardless of the target object, such as 2-8 wafers, waffle trays, adhesive sheet trays, packages, substrates, and glass.

■Features

-Easy to replace wafer/mounting board, ideal for low-volume, high-mix production and test and development applications. ・Mounted wafer 4-8inch (cracked wafer possible) Controlled by PC software ・Various options such as pyramidal collet, pulse heater, scribing, stamping, etc. ・We create customized systems that best suit user needs in terms of layout, budget, functionality, etc. ・Proposing a “one-of-a-kind system” to the world.

  • Product

    Auto flip chip bonder MODEL-400

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2 Models of Auto flip chip bonder MODEL-400

Click on the part number for more information about each product

Image Part Number Price (excluding tax) Applied load Type Alignment accuracy Alignment Function
Auto flip chip bonder MODEL-400-Part Number-M400α

M400α

Available upon quote

50-1,000g

Automatic flip chip bonder

±2.5μm

Automatic

Fully automatic bonding or
Manual alignment by JOG feed

Auto flip chip bonder MODEL-400-Part Number-M400TR

M400TR

Available upon quote

50-1,000g

Automatic chip transfer machine

±5μm

Automatic

Fully automatic wafer → chip tray
Adhesive tray → device-specific tray etc.

Click on the part number for more information about each product

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About Company Handling This Product

Response Rate

100.0%


Response Time

40.5hrs

Company Overview

Hisol Inc., established in 1967 as Kan Electronics, is a manufacturer based in Tokyo, Japan, producing machine...

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  • Japan

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