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Ultra-high precision mounting machine flip chip bonder M1300-M1300
Ultra-high precision mounting machine flip chip bonder M1300-HiSOL,Inc.

Ultra-high precision mounting machine flip chip bonder M1300
HiSOL,Inc.

HiSOL,Inc.'s Response Status

Response Rate

100.0%

Response Time

28.6hours

Relatively Fast Response


About This Product

■Summary

・Ideal for ultra-high precision mounting applications such as laser-related and opto device mounting. ・High reproducibility of load, dispensing, heating, etc. achieved through PC control ・Device posture using bonding in an inert gas atmosphere and laser displacement ・Original control method achieves highest-class mounting accuracy among optical alignment methods

■Features

・Ultra-high precision FC/die bonder developed for high precision mounting of optical components - Compatible with a variety of devices by replacing stage and collet parts. ・Because of optical alignment, the end face of compound devices and inside glass parts are - Mark recognition is possible. Due to low oxygen concentration (100ppm or less) or laser displacement ・High-precision mounting using posture control, chip bonding mounting on 3D structures, etc. ・A rich lineup of optional applications

  • Product

    Ultra-high precision mounting machine flip chip bonder M1300

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1 Models of Ultra-high precision mounting machine flip chip bonder M1300

Image Part Number Price (excluding tax) Applied load Alignment accuracy Alignment Function
Ultra-high precision mounting machine flip chip bonder M1300-Part Number-M1300

M1300

Available upon quote

50-5,000g (load cell replacement)

±1.0μm

X-Y axis manual / Θ axis auto

Semi-automatic FC bonder

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About Company Handling This Product

Response Rate

100.0%


Response Time

28.6hrs

Company Overview

Hisol Inc., established in 1967 as Kan Electronics, is a manufacturer based in Tokyo, Japan, producing machine...

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  • Japan

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