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  2. Semiconductor Manufacturing
  3. Flip Chip Bonders
  4. Die Bonder Manual Epoxy Eutectic Die Bonder Model 7372E (HiSOL,Inc.)
Die Bonder Manual Epoxy Eutectic Die Bonder Model 7372E-7372E
Die Bonder Manual Epoxy Eutectic Die Bonder Model 7372E-HiSOL,Inc.

Die Bonder Manual Epoxy Eutectic Die Bonder Model 7372E
HiSOL,Inc.

HiSOL,Inc.'s Response Status

Response Rate

100.0%

Response Time

28.6hours

Relatively Fast Response

About This Product

■Summary

Model 7372E is a tabletop multi-die bonder equipped with two functions: a eutectic die bonder that mounts chips using a eutectic material (AuSn, etc.) and an epoxy die bonder that mounts chips using an adhesive (epoxy material, silver paste, etc.) is. Work is performed using a new vertical drive mechanism, the X-Y-Z 3-axis manipulator (patented), which provides excellent operability and allows for easy model changes, making it suitable for a wide range of applications, from research and development to small-lot, high-mix production sites. You can use it. Due to the device configuration, there is no limit in the depth direction, so it is also compatible with large boards (250 mm square or more). The scrub function supports mechanical scrub and manual scrub, where you can set the number of scrubs, width, and speed of the scrub.

■Features

・Operation method using vertical drive new mechanism X-Y-Z 3-axis manipulator (patented) ・Epoxy die bonder and eutectic die bonder combined machine, easy to change models ・Equipped with tool heating mechanism as standard, achieving more stable eutectic die bonding - Compatible with adhesive dispensing and stamping ・Includes tip rotation mechanism (adsorbed tips can be freely rotated 360 degrees)

■Standard configuration

・Main body (model 7372E) ・Power supply section ・Microscope section (stereomicroscope, arm, eyepiece, illumination) ・Work holder (normal temperature work holder, work holder with N2 atmosphere mechanism) ・Vacuum pump ・Adhesive dispensing/stamping unit ・Various pickup tools (surface suction collet, pyramidal collet) ・Temperature controller ・Tension gauge

  • Product

    Die Bonder Manual Epoxy Eutectic Die Bonder Model 7372E

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1 Models of Die Bonder Manual Epoxy Eutectic Die Bonder Model 7372E

Image Part Number Price (excluding tax) Weight Load How to operate Radiant heater mechanism Utility Machine dimensions Bonding method Preform puff time (7316E) Pickup detection Pick up method Pick up tool length Pick up diameter tool Delay Before Scrub (7316E) Chip rotation Dai puff time Stage dimensions Scrub mechanism (7316E) Scrub direction (7316E) Scrub rate (speed) (7316E) Scrub mode (7316E) Scrub stroke (width) (7316E) Scrub cycle (number of times) (7316E) Epoxy flow time (7200E) Air hose diameter
Die Bonder Manual Epoxy Eutectic Die Bonder Model 7372E-Part Number-7372E

7372E

Available upon quote

Approximately 45kg

10g~175g

Vertical drive X-Y-Z 3-axis manipulator (patented)

Tool heating mechanism (heater setting temperature is room temperature to 200℃ depending on the amount of winding)

・Power supply voltage: 100VAC・3A (within 10A including accessories) 3P outlet connection
・Frequency: 50/60Hz
・Air: 0.4MPa or more, Nitrogen: 0.2MPa or more

・Body part 610Wx540Dx450Hmm
・Power supply part 225Wx205Dx76Hmm

・7316E mode eutectic bonding method (heat + load + scrub)
・7200E mode Load crimping method

0~25ms Can be set in 1ms increments

Hand switch detection/contact pressure detection selectable

Pick-up by vacuum

0.625 inch (approx. 16mm)

1/16 inch (approx. 1.58mm)

0~50000ms Can be set in 100ms increments

Can be rotated 360 degrees with control knob

0~25ms Can be set in 1ms increments

Work adjustable table (standard stage dimensions)
X=260mm Y=280mm Height adjustment mechanism included
Z axis variable 18mm (+4.5mm, -13.5mm from standard)

Automatic load sensing mechanical scrub/manual scrub

X direction relative to operator

Selectable from Fast/Medium/Slow

・Selectable from Neg/Pos/Both
・Neg: Scrub from center to rear
・Pos: Scrub from the center to the front
・Both: Scrub backward from the center, then scrub forward.

2~16Mil (approx. 50~405μm) Can be set in 1Mil increments

0~100 cycles Can be set in 1 cycle units

0~999ms Can be set in 1ms increments

1/4 inch or 6x4mm (4mm ID) tube connection

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About Company Handling This Product

HiSOL,Inc.

Response Rate

100.0%

Response Time

28.6hrs

Company Overview

Hisol Inc., established in 1967 as Kan Electronics, is a manufacturer based in Tokyo, Japan, producing machine...

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  • Japan

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Flip Chip Bonders
Flip Chip Bonders　HiSOL,Inc.
HiSOL,Inc.

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